Optical engine socket with integrated optical receptacle
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Solution Overview
Problem
The challenge of integrating flyover cables into packaging for optical engines (OEs) in co-packaged optics (CPO) applications is exacerbated by the need for connecting numerous optical fibers to photonic integrated circuits, which affects reliability and serviceability, especially at higher component densities and communication speeds.
Innovation Solution
A socket design for optical engines that includes an array of conductive connections, a frame, and a sidewall with an optical receptacle, allowing for electrical and optical coupling, using precision molding to ensure high dimensional accuracy and thermal stability, with alignment features for precise fiber alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of repair
If connectorized attachment of optical fibers to photonic ICs is used, then serviceability and standardization are improved, but device complexity increases due to integration requirements
Solution Approach 1:
The patent combines the optical fiber connector attachment structure with the socket housing into a single integrated component. The connectorized optical fibers are directly mounted to the socket body, eliminating the need for separate alignment and attachment mechanisms. This merging approach maintains serviceability through connectorized interfaces while reducing overall device complexity by consolidating multiple functions into one structure.
Solution Approach 2:
The socket design incorporates universal features that serve multiple functions: the same socket structure provides both electrical connection via conductive contacts and optical connection via fiber attachment. The integrated design allows the socket to function as both a mechanical mounting structure and a connection interface, reducing the number of separate components needed while maintaining ease of serviceability.
2Productivity
If higher component densities are implemented, then productivity is improved, but reliability deteriorates due to challenges in connecting numerous optical fibers
Solution Approach 1:
The patent merges multiple optical fiber connections into a single integrated connector assembly that attaches to the socket. Instead of individually connecting numerous fibers, the integrated structure allows simultaneous attachment of multiple fibers through one connector unit. This approach enables higher component density while maintaining connection reliability by reducing the number of individual connection points that could fail.
Solution Approach 2:
The optical fiber array is segmented into modular connector assemblies that can be independently attached to the socket. Each connector module handles a specific subset of fibers, allowing for easier management and reduced complexity in high-density configurations. This segmentation maintains reliability by organizing numerous connections into manageable, standardized units.
3Ease of manufacture
If more polymer or plastic material is used in OE, then manufacturing ease is improved, but resilience to solder reflow process deteriorates
Solution Approach 1:
The socket design uses composite material construction, combining metal components for structural integrity and thermal stability with selective polymer applications only where needed for manufacturing ease. The critical areas that require solder reflow resilience use metal or heat-resistant materials, while non-critical areas may use easier-to-manufacture polymers. This composite approach maintains manufacturing ease while ensuring resilience in critical regions.
Solution Approach 2:
The patent applies different materials with appropriate properties to different regions of the optical engine. Areas requiring high thermal stability and solder reflow resilience use metal or heat-resistant materials, while areas where manufacturing ease is prioritized and thermal exposure is minimal may use polymers. This local differentiation of material quality ensures that each region has the properties needed for its specific function.
Data Source
AI summary
Aspects described herein include an apparatus including a socket. The socket includes an array of conductive connections, a frame at least partly circumscribing the array of conductive connections, and a sidewall having an optical receptacle extending therethrough. The optical receptacle is configured to receive an optical connector. The apparatus further includes an optical engine received in the frame into a seated configuration where a photonic integrated circuit of the optical engine is electrically coupled with the array of conductive connections, and is optically coupled with one or more optical fibers of the optical connector.