Optical Engine Module Layout for Light Valve Thermal Balance
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Solution Overview
Problem
Conventional projectors using semiconductor light sources face issues with temperature differences between the front and back ends of the light valve module, leading to potential damage and increased production costs due to separate thermal dissipation structures and design complexity.
Innovation Solution
An optical engine module design that integrates a thermal conductive member on one side of the circuit board, connected to both the light emitting and back sides of the light valve module through opening holes, allowing for unified thermal management and reducing the need for additional thermal dissipation elements on the emitting side.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermal dissipation element or module is disposed at the front end of the light valve module, then the temperature difference between front and back ends is reduced, but the distance between the light valve module and optical element increases, causing design complexity and hindering system miniaturization
Solution Approach 1:
The patent merges the thermal dissipation function into the existing circuit board structure by adding a thermal conductive member to the back side, combining support and thermal management functions into a single integrated component rather than adding separate front-end thermal dissipation elements
Solution Approach 2:
The patent shifts the thermal dissipation approach from the front dimension (optical path side) to the back dimension (circuit board side), utilizing the z-axis thermal conduction path through the circuit board to reduce temperature difference without interfering with optical element positioning
2Temperature
If separate thermal dissipation structures are designed for the front end and back end of the light valve module, then temperature control is improved, but production cost increases
Solution Approach 1:
The patent combines the thermal dissipation structures into a single unified system where the thermal conductive member on the back side works in conjunction with the light valve module itself, eliminating the need for separate front-end and back-end thermal dissipation components and reducing manufacturing complexity
Solution Approach 2:
The circuit board's thermal conductive member serves multiple functions: it provides structural support, establishes electrical connections, and acts as a thermal dissipation path, reducing the need for additional dedicated thermal management components
3Illumination intensity
If semiconductor light sources are used to increase projector brightness, then light output is improved, but the operating temperature of the light valve module rises, causing potential damage
Solution Approach 1:
The patent converts the harmful heat generated by high-brightness semiconductor light sources into a manageable thermal conduction path by utilizing the circuit board's thermal conductive member to channel heat away from the light valve module, transforming a reliability threat into a controlled thermal management solution
Solution Approach 2:
The thermal conductive member acts as an intermediary between the light valve module and the heat sink, providing a dedicated thermal pathway that mediates the heat transfer process and protects the light valve module from thermal damage while maintaining high brightness operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces temperature differences, simplifies optical path design, and lowers production costs by minimizing the space required for thermal dissipation structures, enhancing integration and reducing complexity.
Implementation Method 1
The thermal conductive member is disposed on the second surface of the circuit board, and is connected to the back surface of the light valve module through the first opening hole of the circuit board
Implementation Method 2
The supporting member is partially in contact with the light valve module, and is connected to the thermal conductive member through the at least one second opening hole of the circuit board
Data Source
AI summary
An optical engine module including a circuit board, a light valve module, a thermal conductive member, and a supporting member is provided. The circuit board having a first surface, a second surface opposite to the first surface, a first opening hole and at least one second opening hole. The light valve module is disposed on the first surface and electrically connected to the circuit board. The thermal conductive member is disposed on the second surface of the circuit board and is connected to a back surface of the light valve module through the first opening hole of the circuit board. A supporting member is disposed on one side of the first surface of the circuit board. The supporting member is partially in contact with the light valve module, and is connected to the thermal conductive member through the at least one second opening hole of the circuit board.