Optical Engine Package Layout for Warpage Control and Higher Yield
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Solution Overview
Problem
Existing optical engines require longer electrical interconnections between photonic and electronic dies, which are inefficient and costly, and the use of photonic dies the same length as encapsulating materials reduces wafer yield and increases production costs.
Innovation Solution
The implementation of a semiconductor package or chip package with an optical engine that includes a photonic die stacked on an electronic die and a dummy die on the side of the photonic die, where the photonic die is shorter than the encapsulating material, allowing the photonic and dummy dies to collectively support the electronic die and encapsulating material, thereby reducing warpage and increasing yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the photonic die is made the same length as the encapsulating material to provide mechanical support, then warpage is prevented, but wafer yield decreases and production costs increase
Solution Approach 1:
The mechanical support function is segmented between two components: the photonic die (which can be smaller) and a dummy die added adjacent to it. Together they provide the necessary length and structural support to prevent warpage, while the photonic die itself can be reduced in size to increase wafer yield.
Solution Approach 2:
A dummy die is introduced as an intermediary element that fulfills the mechanical support requirement. This dummy die acts as a placeholder or filler that provides the necessary length and structural integrity without requiring the photonic die to be oversized, thus resolving the conflict between support stability and production efficiency.
2Reliability
If electrical interconnections are run through the substrate to connect photonic and electronic dies, then electrical connection is achieved, but interconnection length increases and cost increases
Solution Approach 1:
The interconnection approach transitions from a planar layout (side-by-side dies with long substrate traces) to a vertical stacking architecture. The photonic die is positioned directly above the electronic die, enabling short vertical interconnections through the substrate, thereby dramatically reducing interconnection length while maintaining electrical connection reliability.
3Productivity
If the photonic die length is reduced to increase wafer yield, then production costs decrease, but mechanical support capability is insufficient causing warpage
Solution Approach 1:
The mechanical support function is segmented between two components: the photonic die (which can be smaller) and a dummy die added adjacent to it. Together they provide the necessary length and structural support to prevent warpage, while the photonic die itself can be reduced in size to increase wafer yield.
Solution Approach 2:
A dummy die is introduced as an intermediary element that fulfills the mechanical support requirement. This dummy die acts as a placeholder or filler that provides the necessary length and structural integrity without requiring the photonic die to be oversized, thus resolving the conflict between support stability and production efficiency.
Data Source
AI summary
Novel tools and techniques are provided for implementing a semiconductor or optical engine package, and more particularly methods, systems, and apparatuses are provided for implementing a semiconductor package including a dummy die coupled to a top surface of a fan-out wafer comprising an electronic die and coupled to a side of a photonic die. In various embodiments, an apparatus includes a first layer comprising an electronic die. A photonic die can be stacked on and coupled to the electronic die and a dummy die can be coupled to a first side of the photonic die and coupled to the first layer.