Semiconductor Optical Facet Structure for Easy Orientation Detection
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Solution Overview
Problem
The orientation of semiconductor optical devices, particularly those with low- and high-reflection films, cannot be visually differentiated due to similar reflectance, making it difficult to distinguish the front and rear facets during mounting.
Innovation Solution
A semiconductor optical device design featuring a substrate with a flat first side and a second side having an upper and lower side forming a step, where an optical function layer is positioned on top, and distinct films with different reflectance cover the end faces, allowing for easy differentiation between the front and rear facets.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If low- and high-reflection films are used on end faces, then optical performance is improved, but visual differentiation between front and rear facets is lost
Solution Approach 1:
The patent applies color coating to the end faces of the semiconductor optical device. The front facet and rear facet are coated with different colors, enabling visual differentiation between the two ends. This color coding allows operators to quickly identify the orientation of the device during mounting and assembly without affecting the optical performance provided by the low- and high-reflection films.
2Reliability
If resist is used to form asymmetric protection films, then asymmetric reflectance is achieved, but process complexity and cost increase
Solution Approach 1:
The patent forms asymmetric protection films by applying a single continuous protection film over the entire wafer surface, then selectively removing the film from one end face through cleavage. This creates asymmetric reflectance where one end face has a protection film and the other does not, eliminating the need for complex resist patterning processes while achieving the desired asymmetric optical properties.
3Reliability
If protection films are formed on cleaved surfaces, then film damage is prevented, but additional deposition processes are required
Solution Approach 1:
The patent forms the protection film on the end faces before the cleavage process. By preparing the protection film in advance on the intact wafer, the film is already in place to protect the surfaces after cleavage, eliminating the need for additional post-cleavage deposition processes and improving manufacturing efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables accurate and quick determination of the device orientation without the need for high magnification, improving manufacturing efficiency and reducing costs by preventing film damage during the deposition process.
Implementation Method 1
a first film continuously covering the first end face and the first side; a second film different in reflectance from the first film, the second film continuously covering the second end face and the upper side of the second side
Data Source
AI summary
A substrate includes first and second sides, the first side being flat, the second side including upper and lower sides, the lower side protruding from the upper side to form a step. An optical function layer is on a top of the substrate, the optical function layer including first and second end faces, the first end face being flush with the first side, the second end face being flush with the upper side of the second side. A first film continuously covers the first end face and the first side. A second film is different in reflectance from the first film, the second film continuously covering the second end face and the upper side. A first electrode is electrically connected to a top of the optical function layer. A second electrode is electrically connected to a bottom of the optical function layer.