Optical Feedthrough for Hermeticity Testing of Microstructured Assemblies
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Solution Overview
Problem
Existing methods for testing the hermeticity of optical assemblies, especially in miniaturized packages, are costly, lack sensitivity, and are often destructive, making it difficult to reliably assess the longevity and functionality of optical assemblies throughout their life stages.
Innovation Solution
An optical assembly with an integrated optical microstructure and a physical parameter sensor arrangement that forms a sealed cavity, using an optical feedthrough for non-destructive measurement and communication of hermeticity parameters, allowing for cost-effective and sensitive testing without the need for expensive sensors or additional manufacturing technologies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If expensive sensors such as quartz crystals are used for hermeticity testing, then measurement precision is improved, but device complexity and cost increase
Solution Approach 1:
The patent replaces complex mechanical/hermetic sensors (quartz crystals, mass spectrometry) with a simple optical sensor system. The optical sensor detects hermeticity by measuring physical parameters (temperature, pressure, gas composition) through optical properties (refractive index, absorption, scattering) without requiring complex mechanical structures, thereby achieving high measurement precision with reduced device complexity
Solution Approach 2:
The patent introduces an optical intermediary (light) to indirectly measure hermeticity parameters. Instead of directly measuring mass or pressure with complex sensors, the system uses optical properties of the medium inside the sealed package as an intermediary to convey hermeticity information, simplifying the sensing mechanism while maintaining detection sensitivity
2Reliability
If traditional hermeticity testing methods are used, then leak detection capability is improved, but productivity decreases due to destructive testing
Solution Approach 1:
The patent enables the optical sensor to continuously monitor hermeticity parameters without requiring external intervention or destructive procedures. The sensor autonomously detects changes in physical parameters through optical measurements, allowing for non-destructive, repeatable testing that maintains productivity while ensuring reliable leak detection throughout the product lifecycle
Solution Approach 2:
The patent implements hermeticity sensing that can be performed at early manufacturing stages (wafer level, pre-assembly) before final packaging. This preliminary sensing capability allows for early defect detection and sorting, preventing defective units from proceeding to later production stages, thereby improving overall productivity by reducing rework and waste
3Reliability
If hermeticity testing is performed at multiple life stages, then reliability assessment is improved, but loss of time increases
Solution Approach 1:
The patent implements continuous hermeticity monitoring capability where the optical sensor can repeatedly measure physical parameters at different time points (manufacturing, storage, operation) without interrupting the product lifecycle. The non-destructive nature of optical measurements allows for continuous or periodic assessment, providing comprehensive reliability data across the entire product lifetime without significant time loss
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient, cost-effective, and highly sensitive hermeticity testing of optical assemblies at various stages, from manufacturing to implementation, using an all-optical approach that is compatible with existing manufacturing processes and suitable for wafer-scale testing without damaging the assembly.
Implementation Method 1
providing an optical feedthrough integrated in the substrate between the physical parameter sensor arrangement and the optical microstructure, the optical feedthrough forming a communication path from within the sealed cavity to an area outside the sealed cavity
Data Source
AI summary
A method for testing an optical assembly (1) which has an optical microstructure (3) integrated with a substrate (2). The optical microstructure (3) is positioned to form an external optical interaction area (4) on a part of a surface (5) of the substrate (2). A cover cap (6) seals at least a part of the surface (5) of the substrate (2) adjacent to the optical microstructure (3) to obtain a sealed cavity (9). An optical feedthrough (10) is integrated in the substrate (2) to form an external communication path from within the sealed cavity (9). The optical feedthrough (10) allows communication of a physical parameter value which is measured inside the sealed cavity (9) to outside the sealed cavity (9). The physical parameter value is associated with a measure of hermeticity of the sealed cavity (9).