Optical Fiber Block Alignment with Adhesive Curing Feedback

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Solution Overview

Problem

Existing methods for connecting optical fibers to optical waveguides on silicon photonics circuits face challenges such as positional shifts due to adhesive curing shrinkage, leading to connection losses and increased manufacturing costs.

Innovation Solution

A method and device for actively aligning an optical fiber block with an optical circuit board, utilizing an adhesive supply unit, light receiving unit, optical fiber aligning mechanism, and controller to maximize light intensity and adjust for adhesive curing, thereby minimizing positional deviation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If adhesive is used to bond optical fiber block to optical circuit board, then connection is achieved, but positional shift occurs due to curing shrinkage

Engineering Contradiction:

Improveconnection stabilityVSAvoidpositional accuracy

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The patent performs preliminary alignment of the optical fiber block to the optical circuit board before the adhesive fully cures. By measuring light intensity during the curing process and adjusting positions accordingly, the alignment is optimized while the adhesive is still pliable, preventing positional shift caused by subsequent curing shrinkage.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent implements a feedback mechanism by measuring the light intensity emitted from the optical circuit board through the adhesive during curing. This light intensity measurement provides real-time feedback on the alignment quality, allowing continuous adjustment of the optical fiber block position to maximize coupling efficiency while compensating for adhesive shrinkage.

Inventive Principle:

Principle #23Feedback

2Manufacturing precision

If alignment is performed after adhesive curing, then connection is stable, but connection loss occurs due to positional shift

Engineering Contradiction:

Improvealignment accuracyVSAvoidoptical connection loss

Core Design Contradiction:

Manufacturing precisionVSLoss of energy

Solution Approach 1:

The patent performs alignment operations during the adhesive curing process rather than after completion. By maximizing light intensity coupling while the adhesive is still curing, the optimal alignment position is established before the adhesive hardens, ensuring both high precision and minimal connection loss.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent maintains continuous alignment optimization throughout the adhesive curing process by repeatedly measuring light intensity and adjusting positions. This continuous action ensures that the alignment remains optimal throughout the entire curing period, preventing connection loss that would occur if alignment were only performed after curing.

Inventive Principle:

Principle #20Continuity of useful action

3Strength

If adhesive curing time is extended, then bond strength increases, but manufacturing time increases

Engineering Contradiction:

Improveadhesive bond strengthVSAvoidmanufacturing cycle time

Core Design Contradiction:

StrengthVSLoss of time

Solution Approach 1:

The patent uses light intensity measurement as a feedback indicator to determine the optimal curing time. By monitoring how light intensity changes during curing, the process can identify when sufficient bond strength has been achieved, allowing for optimized curing time that balances strength development with manufacturing efficiency.

Inventive Principle:

Principle #23Feedback

Solution Approach 2:

The adhesive curing process itself provides the alignment information needed for optimization. The changing optical properties of the adhesive during curing (which affect light intensity transmission) serve as a built-in indicator of curing progress, eliminating the need for separate strength testing or extended curing times.

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively suppresses positional deviation between the optical fiber and the light input unit, ensuring high-efficiency optical coupling and reducing manufacturing costs by simplifying the alignment process.

Implementation Method 1

an adhesive protruding from a lower surface of a ferrule is absorbed by a groove due to a capillary phenomenon

Methodology Applied

Scientific EffectCapillary action: Capillary Action

Implementation Method 2

a light receiving unit that receives light emitted from the optical circuit board

Methodology Applied

Scientific EffectLight detection: Photoelectric Effect

Implementation Method 3

starting curing of the adhesive

Methodology Applied

Scientific EffectCuring: Photopolymerisation

Data Source

PatentUS20250093586A1Method for connecting optical waveguide and optical waveguide connection device

Publication Date: 2025.03.20 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

AI summary

A method for connecting an optical waveguide includes supplying adhesive (3) to near a light input unit on an optical circuit board, aligning optical fiber block (2) holding optical fiber (2a) with respect to the optical circuit board to maximize intensity of light emitted from the optical circuit board, starting curing of the adhesive, measuring a curing degree of the adhesive and an adhesive curing time during the curing of the adhesive, and repeating the alignment of the optical fiber block holding the optical fiber with respect to the optical circuit board to maximize the intensity of the light emitted from the optical circuit board in a state where the degree of curing is less than or equal to a certain threshold value.