Optical Fiber Array Assembly With Low-Alignment Connector Housing
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Solution Overview
Problem
The high cost and alignment challenges of optical interconnects for disaggregated computing applications, particularly in chip-to-chip connections, are not effectively addressed by existing technologies, which include VCSEL arrays and imaging fiber bundles, leading to inefficiencies and increased costs.
Innovation Solution
Optimized optical fibers with specific refractive index profiles and coating layers, allowing for low-cost, high-density two-dimensional arrays that can be assembled without precise micro-hole alignment, using a connector housing to facilitate flexible and reliable connections with micro-LED arrays.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If VCSEL arrays and imaging fiber bundles are used for optical interconnects, then optical connection capability is achieved, but manufacturing cost and alignment complexity increase
Solution Approach 1:
The optical fiber is segmented into distinct functional layers: inner core for light transmission, cladding layer with specific refractive index for optical confinement, and coating layer for mechanical protection. This segmentation allows each layer to be optimized independently, reducing overall manufacturing complexity while maintaining optical performance
Solution Approach 2:
The patent specifies precise parameter ranges for the refractive index delta (1.8 to 2.6) and profile shape parameter (α) of the inner core, along with coating layer thickness (less than 30 μm) and modulus (≥0.5 GPa). By controlling these parameters within defined ranges, the fiber achieves optimal optical efficiency without requiring complex alignment procedures during assembly
2Productivity
If high-density optical fiber arrays are implemented, then interconnect capacity increases, but assembly precision requirements increase
Solution Approach 1:
The optical fiber assembly is designed to be self-aligning through the connector housing structure and the specific dimensional specifications of the fibers. The coating layer with controlled thickness and modulus provides consistent outer dimensions that facilitate automatic positioning during assembly, reducing the need for high-precision manual alignment while maintaining high-density configuration
Solution Approach 2:
The patent transitions from traditional single-mode fiber designs to a multi-dimensional structure with inner core, cladding layer, and coating layer, each contributing to dimensional control. This layered approach enables precise control of the overall fiber diameter and geometry, allowing high-density array assembly without requiring extremely tight tolerances on individual component placement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides low-cost, high-density optical interfaces with improved optical efficiency and flexibility, reducing assembly costs and maintaining reliability in short-range optical interconnect applications.
Implementation Method 1
an inner core having a core refractive index delta and profile shape parameter α
Implementation Method 2
a cladding layer surrounding the inner core. The cladding layer includes an inner cladding segment having an inner refractive index delta, a trench segment having a trench refractive index delta, and an outer cladding segment having an outer refractive index delta
Data Source
AI summary
In one embodiment, an optical fiber includes an inner core having a core refractive index delta and profile shape parameter α in the range of 1.8 to 2.6, including endpoints, and a cladding layer surrounding the inner core. The cladding layer includes an inner cladding segment having an inner refractive index delta, a trench segment having a trench refractive index delta, and an outer cladding segment having an outer refractive index delta. The optical fiber further includes a coating layer surrounding the cladding layer and having a thickness of less than 30 μm and a modulus greater than or equal to 0.5 GPa.


