Optical Fiber-to-Chip Interconnection with Active Ferrule Alignment
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Solution Overview
Problem
The increasing I/O capacities of electronic processing chips exceed the electrical I/O capacity across a practically viable electronic chip package, necessitating a higher I/O capacity per unit area, which can be achieved through optical interconnects using optical fibers and photonic integrated circuits.
Innovation Solution
A connector assembly is provided for optically connecting optical fibers to photonic integrated circuits, involving a method that includes attaching an optical subassembly, aligning a ferrule frame to the subassembly using an active alignment process, and securely connecting the ferrule frame after adjusting its position based on light transfer characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If electrical I/Os are used to increase I/O capacity, then the I/O capacity per unit area is limited, but the chip package size must be increased to accommodate more electrical I/Os
Solution Approach 1:
The patent replaces electrical I/O connections with optical I/O connections using photonic integrated circuits and optical fibers. This substitution enables significantly higher I/O capacity per unit area because optical signals can be transmitted through dense arrays of vertical coupling elements on the chip surface, overcoming the spatial limitations of electrical I/Os
2Quantity of substance
If optical fibers are coupled to photonic integrated circuits, then high I/O capacity is achieved, but precise alignment between optical fibers and vertical coupling elements is required
Solution Approach 1:
The patent implements preliminary alignment actions during the assembly process by providing adjustment mechanisms that allow the ferrule frame and optical subassembly to be positioned and aligned before final securing. This preliminary adjustment ensures precise alignment between optical fibers and vertical coupling elements while maintaining manufacturing feasibility
Solution Approach 2:
The patent introduces dynamic adjustment capabilities through movable mounting structures that allow the optical subassembly to be repositioned relative to the ferrule frame. This dynamic positioning enables fine-tuning of alignment during assembly, achieving the required precision without overly complex manufacturing processes
3Manufacturing precision
If active alignment process is used to align ferrule frame, then alignment precision is improved, but the manufacturing process becomes more complex and time-consuming
Solution Approach 1:
The patent divides the alignment process into distinct segments: initial positioning of the optical subassembly, active alignment adjustments, and final securing. This segmentation allows each step to be optimized independently, balancing precision requirements with manufacturing efficiency by limiting the scope of complex active alignment to only the critical coupling interface
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables high-precision alignment of optical fibers with photonic integrated circuits, facilitating efficient light transfer and suitable for mass production with reduced maintenance costs in data centers.
Implementation Method 1
transferring light between at least one optical fiber in the array of optical fibers and the photonic integrated circuit through the optical subassembly and at least one of the vertical-coupling elements
Data Source
AI summary
A method of assembling an optical device including: providing a photonic integrated circuit including a plurality of vertical-coupling elements disposed along a main surface of the photonic integrated circuit; attaching an optical subassembly to the photonic integrated circuit; removably connecting a fiber connector to a ferrule frame, in which the fiber connector is attached to an array of optical fibers; aligning the ferrule frame to the optical subassembly using an active alignment process; and securely connecting the ferrule frame to the optical subassembly after the active alignment process.