Multichannel optical fiber fluorescence temperature measurement device and method for electrostatic chuck in etcher
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Solution Overview
Problem
Existing temperature measurement apparatuses for electrostatic chucks in etchers provide only local temperature measurement with limited accuracy (+1°C) and a range below 200°C, failing to meet the requirements for precise temperature control and uniformity across the entire semiconductor wafer.
Innovation Solution
A multichannel optical fiber fluorescence temperature measurement device with temperature sensors arranged at different regions of the electrostatic chuck, utilizing fluorescence temperature probes, thermal conductive layers, and optical fibers to achieve accurate temperature distribution measurement, featuring gold-plated components for void-free connections and a copper-diamond composite material for rapid heat conduction, enabling temperature measurement accuracy of ≤+0.1°C and a range from -120°C to 450°C.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional temperature measurement apparatus is used, then local temperature measurement is achieved, but temperature measurement accuracy and range are insufficient
Solution Approach 1:
The patent divides the temperature measurement system into multiple independent temperature sensors arranged at different regions of the electrostatic chuck. Each sensor independently measures temperature at its specific location, enabling both local precision and global temperature distribution control across the semiconductor wafer surface.
Solution Approach 2:
The patent replaces conventional electrical temperature measurement systems with an optical fiber fluorescence-based temperature measurement system. This substitution eliminates electrical interference and enables high-precision temperature measurement (accuracy ≤ +0.1°C) across a wide temperature range (-120°C to 450°C) without the limitations of traditional apparatus.
2Manufacturing precision
If single-point temperature measurement is used, then device complexity is reduced, but temperature distribution control is insufficient
Solution Approach 1:
The patent implements multiple temperature sensors at different regions of the electrostatic chuck to capture the complete temperature distribution across the semiconductor wafer surface. This segmented measurement approach enables precise control of temperature uniformity while maintaining manageable system complexity through modular sensor design.
Solution Approach 2:
The patent employs a unified optical fiber fluorescence measurement technology that serves multiple functions: it provides high-precision temperature measurement (accuracy ≤ +0.1°C), wide temperature range coverage (-120°C to 450°C), and simultaneous multi-point measurement capability. This universal approach achieves comprehensive temperature distribution control without requiring different measurement systems for different temperature conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device enables simultaneous, accurate temperature measurement across the semiconductor wafer surface with high consistency and interchangeability, achieving rapid thermal conduction and high frequency temperature readings, overcoming the limitations of previous systems.
Implementation Method 1
The operation light source module is configured to output incident light capable of exciting the fluorescent layer to generate fluorescence, and the photodetection module is configured to detect lifetime of a fluorescence signal reflected by the fluorescent layer
Implementation Method 2
The thermal conductive layer includes a copper-diamond composite material
Data Source
AI summary
Provided are a multichannel optical fiber fluorescence temperature measurement device for an electrostatic chuck in an etcher and a method. The device includes temperature sensors. Each temperature sensor includes a fluorescence temperature probe, a ceramic sleeve, a transition optical fiber, a transmission optical fiber, an optical coupling module, a photodetection module, and an operation light source module. The fluorescence temperature probe includes a fluorescent layer and a thermal conductive layer. An end face of the fluorescent layer is gold-plated. The thermal conductive layer includes a copper-diamond composite material, an end face thereof is gold-plated, and connected to the end face of the fluorescent layer by a vacuum reflow void-free welding process. The ceramic sleeve coats the transition optical fiber, an end face thereof is gold-plated, and connected to the fluorescence temperature probe by the vacuum reflow void-free welding process.