Optical Fiber Array Lid Design for Adhesive Overflow Control

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Traditional passive alignment methods in fiber-based co-packaged optics face issues with adhesive overflow into waveguides, leading to high insertion loss and reliability problems, especially during high-temperature solder reflow conditions.

Innovation Solution

A uniquely configured lid apparatus with a first segment to urge adhesive against fibers and a second segment to accommodate excess adhesive, preventing contact with waveguides, and a channel to manage adhesive flow.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If traditional passive alignment is used to attach the fiber array unit, then throughput is improved and fiber alignment is achieved, but adhesive flows over the fiber tips to cover the waveguide causing high insertion loss and reliability issues

Engineering Contradiction:

ImprovethroughputVSAvoidinsertion loss and reliability

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The lid is divided into two segments: a first segment (front portion) that urges adhesive against the fiber tips, and a second segment (rear portion) that accommodates excess adhesive. This segmentation prevents adhesive from flowing onto the waveguide while maintaining the benefits of passive alignment

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The lid acts as an intermediary component between the adhesive and the waveguide. By positioning the lid between the adhesive flow path and the waveguide, it intercepts and contains the adhesive, preventing direct contact with the waveguide that would cause insertion loss

Inventive Principle:

Principle #24Intermediary (Mediator)

2Stability of the object's composition

If adhesive is dispensed on the fibers to lock them in place, then fiber alignment is secured, but the adhesive is forced to spread horizontally and flow over beyond the fiber tip to cover the waveguide

Engineering Contradiction:

Improvefiber alignmentVSAvoidadhesive overflow

Core Design Contradiction:

Stability of the object's compositionVSObject-generated harmful factors

Solution Approach 1:

Different portions of the lid have different functions: the first segment (front portion) is designed to urge adhesive against the fibers to secure alignment, while the second segment (rear portion) is designed to accommodate and contain excess adhesive. This local differentiation of function prevents adhesive overflow onto the waveguide

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS20250306306A1Lid design, materials and process for passive FAU alignment in co-package optics

Publication Date: 2025.10.02 INTEL CORP

AI summary

Various aspects of the present disclosure generally relate to an apparatus and methods for coupling a fiber array unit to an optical die. The apparatus may include an optical die, that may include a plurality of grooves. The apparatus may include a plurality of optical fibers, arranged in the plurality of grooves. The apparatus may include a lid that may include a first surface and a second surface, opposite the first surface, wherein the second surface is non-parallel to the first surface, and an adhesive layer between the optical die and the second surface of the lid.