Optical Fiber Mold Attachment With Injection And Vent Holes

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Solution Overview

Problem

Existing methods for attaching fiber optic sensors to structures are inefficient, requiring drilling or welding, lack flexibility in substrate compatibility, and do not ensure consistent pre-strain or protection from environmental factors.

Innovation Solution

A mold device with a base layer and second portions forming a cavity, featuring holes for material injection and air escape, securely attaches optical fibers with adhesive, allowing strain transmission or isolation, and protects against environmental stress.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If drilling or welding methods are used to attach fiber optic sensors to structures, then the attachment is secure, but the process becomes complex and time-consuming

Engineering Contradiction:
Improveattachment securityVSAvoidattachment process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent introduces an intermediary attachment device that mediates between the fiber optic sensor and the structure. This device includes a base layer with a cavity for receiving the sensor, adhesive material for bonding, and a protective coating layer. The intermediary device simplifies the attachment process by replacing complex drilling and welding operations with a modular bonding system that can be applied to various substrate types without requiring invasive structural modifications.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The attachment device is segmented into distinct functional layers: a base layer for structural support and substrate attachment, a cavity region for sensor containment, adhesive material for bonding, and a protective coating layer. This segmentation allows each component to perform its specific function independently, making the overall attachment process more manageable and adaptable to different applications.

Inventive Principle:
Principle #1Segmentation

2Ease of manufacture

If traditional attachment methods are used, then the process is simple, but flexibility in substrate compatibility is limited

Engineering Contradiction:
Improveattachment process simplicityVSAvoidsubstrate compatibility
Core Design Contradiction:
Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The attachment device is designed with universal applicability through its base layer that can bond to multiple substrate types including concrete, metal, and plastic. The adhesive material and protective coating layer are formulated to provide compatibility across different materials, allowing the same attachment device design to be used on diverse substrates without requiring material-specific customization or complex preparation procedures.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Productivity

If conventional attachment methods are used, then installation is rapid, but consistent pre-strain and environmental protection are not ensured

Engineering Contradiction:
Improveinstallation speedVSAvoidpre-strain consistency
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The attachment device incorporates preliminary action through the pre-formed cavity in the base layer that is specifically shaped and positioned to receive the fiber optic sensor. The cavity geometry is designed in advance to apply consistent pre-strain to the sensor upon insertion, eliminating the need for post-installation adjustment. The protective coating layer is also applied in advance as an integral part of the device, providing immediate environmental protection without requiring additional installation steps.

Inventive Principle:
Principle #10Preliminary action

4Ease of operation

If fiber optic sensors are exposed to the environment, then installation is straightforward, but sensitivity is compromised by environmental stressors

Engineering Contradiction:
Improveinstallation easeVSAvoidenvironmental stressor exposure
Core Design Contradiction:
Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The attachment device employs a protective coating layer that acts as a flexible shell enclosing the fiber optic sensor within the cavity. This thin film barrier protects the sensor from environmental stressors such as moisture, chemicals, and physical damage while maintaining the sensor's sensitivity. The coating layer is integrated into the device structure, providing protection without adding complexity to the installation process.

Inventive Principle:
Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Facilitates rapid, repeatable attachment of fiber optic sensors to various substrates with consistent pre-strain, ensuring durability and sensitivity by sealing the sensors from environmental stressors.

Implementation Method 1

The mold device and the optical fiber are placed on a structure surface and the adhesive is placed in the mold device

Methodology Applied
Scientific EffectAdhesive bonding: Adhesive

Implementation Method 2

injecting the mold material into the first hole of the mold device

Methodology Applied
Scientific EffectPressure-driven material flow: Pressure Increase

Data Source

PatentEP4141388B1Optical fiber attachment device
Publication Date: 2025.10.08 PALO ALTO RESEARCH CENTER INC
  • EP4141388B1 patent drawingFigure 1A
  • EP4141388B1 patent drawingFigure 1B~1C
  • EP4141388B1 patent drawingFigure 1D~1E

AI summary

An optical fiber mold device has a first portion that includes a base layer having a longitudinal feature configured to receive an optical fiber. At least one second portion is disposed over the base layer. The second portion has a center wall and front and back end walls. The center wall, the front end wall, and the back end wall form a mold cavity. At least one first hole is disposed in the mold cavity and is configured to allow mold material to enter the mold cavity. At least one second hole in the mold cavity is configured to allow air displaced by the mold material to exit the mold cavity.