Optical Fiber Mounts for PCB Signal Loss Reduction
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Solution Overview
Problem
Current circuit board designs face challenges in providing efficient optical coupling between multiple integrated circuit devices due to bulky bundled optical fiber arrays, which complicate placement, bending, and alignment, and result in higher signal propagation loss compared to other optical coupling techniques.
Innovation Solution
The development of optical fiber mounts with channels that route individual clad optical fibers or bundles, offering flexible routing and reducing signal propagation loss by using dielectric materials and conductive traces for secure mounting and electrical interconnection, while maintaining low signal loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bulky bundled optical fiber arrays are used for optical coupling between ICs, then optical signaling can be achieved, but placement, bending, and alignment become complicated and signal propagation loss increases
Solution Approach 1:
The patent divides the optical fiber array into individual fiber channels within the substrate. Each optical fiber is routed through separate vias or channels in the substrate, allowing independent positioning and alignment. This segmentation enables precise control over each fiber's path, reducing signal loss while maintaining routing flexibility.
Solution Approach 2:
The patent transitions from surface-level fiber bundling to three-dimensional routing through substrate layers. Optical fibers are positioned in vias that extend through multiple substrate layers, enabling vertical and lateral routing in different dimensions. This multi-dimensional approach allows fibers to reach appropriate IC interfaces without the complications of surface-level bundling.
2Productivity
If optical signaling is implemented between multiple ICs on a circuit board, then data transfer and bandwidth increase, but the design and assembly becomes difficult and expensive
Solution Approach 1:
The patent integrates optical fiber routing directly into the substrate structure, merging the optical interconnect function with the existing circuit board infrastructure. The substrate serves dual purposes as both the mechanical support for ICs and the routing medium for optical fibers, eliminating the need for separate fiber management components and simplifying overall design.
Solution Approach 2:
The substrate acts as an intermediary structure that facilitates optical coupling between ICs. By incorporating vias and channels into the substrate, the patent provides a mediating pathway that simplifies the connection process between separate IC components, making optical interconnect implementation more straightforward and cost-effective.
Data Source
AI summary
An integrated circuit package includes a substrate with an integrated circuit device mounting surface, and at least one optical fiber mount in the substrate. The optical fiber mount includes a support having at least one optical fiber mounting channel, and the optical fiber mounting channel is configured to mount at least one clad optical fiber.