Optical Fiber Element Wire Primary Layer for Void Healing
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Solution Overview
Problem
Optical fiber element wires experience increased transmission loss due to voids or peeling between the bare wire part and the primary layer when subjected to lateral pressure, leading to non-uniformity and bending issues.
Innovation Solution
The optical fiber element wire is designed with a primary layer having a Young's modulus of 0.10 to 0.45 MPa and a pull-out force of 0.6 to 1.2 N/mm, ensuring that voids occur before peeling or cracking, which can be healed by heating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the optical fiber element wire is subjected to lateral pressure during manufacturing or cable assembly, then the wire is compacted and arranged, but voids or peeling occur between the bare wire part and the primary layer causing increased transmission loss
Solution Approach 1:
The patent applies preliminary action by pre-heating the optical fiber element wire before it undergoes lateral pressure during manufacturing. This pre-heating treatment is performed in advance to ensure the primary layer material is in a softened state that can accommodate subsequent compression without forming voids or peeling, thereby maintaining transmission quality while enabling efficient manufacturing processes.
Solution Approach 2:
The patent utilizes parameter changes by controlling the temperature of the primary layer material during the manufacturing process. By heating the wire to a specific temperature range, the material properties of the primary layer are changed to become more compliant and less prone to void formation under compression. This temperature parameter control allows the material to adapt to lateral pressure without developing defects that would increase transmission loss.
2Strength
If the primary layer is made softer to prevent peeling under pressure, then adhesion improves, but the layer becomes more prone to deformation and void formation
Solution Approach 1:
The patent applies dynamics by making the primary layer's mechanical properties time-dependent through temperature control. During the manufacturing process when lateral pressure is applied, the layer is heated to become softer and more compliant, allowing it to conform to pressure without peeling. After the pressure is removed, the layer cools and regains its structural rigidity, maintaining uniformity and preventing permanent deformation. This dynamic property change allows the layer to adapt to different process stages.
Solution Approach 2:
The patent utilizes phase transitions by exploiting the thermal transition of the primary layer material between a softened state during compression and a solidified state during cooling. The material undergoes a phase-like transition when heated, becoming more compliant and resistant to peeling under pressure. Upon cooling after the pressure is removed, it transitions back to a stable, uniform structure, preventing permanent deformation while maintaining strong adhesion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses transmission loss by allowing voids to disappear through heating, while peeling and cracking remain stable, maintaining low transmission loss even under stress.
Implementation Method 1
the inventors of the present application have found that, if voids have occurred within the primary layer, the voids disappear when the optical fiber element wire is heated
Data Source
AI summary
An optical fiber element wire includes a bare wire part including a core and a cladding and extending in an axial direction of the bare wire part, a primary layer covering the bare wire part, and a secondary layer covering the primary layer. The optical fiber element wire is configured such that, when a point load is applied to the optical fiber element wire with a spherical pin having a diameter of 3 mm, a void occurs in the primary layer before peeling occurs between the bare wire part and the primary layer and before cracking occurs within the primary layer.