Optical Filter Dicing with Substrate Stacking Against Coating Chipping
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Solution Overview
Problem
Chipping during the cutting of small optical filters damages the coating, leading to incorrect measurements by photodiodes due to the filter's inability to block unwanted bandwidths.
Innovation Solution
A method involving a substrate stack formation with a second substrate over the optical filter coating, followed by dicing to create individual portions with the coating as an interlayer, using a circular rotating saw disc, and optionally chamfering the edges to protect the coating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the glass substrate is cut to obtain the optical filter with desired shape and size, then the optical filter can be obtained with correct dimensions, but chipping occurs near the cutting edge which damages the optical filter coating
Solution Approach 1:
A protective layer is applied to the optical filter coating before cutting. This preliminary protective measure prevents chipping during the cutting process while allowing the coating to be damaged during manufacturing. The protective layer is subsequently removed after cutting, leaving the coating intact and undamaged.
2Manufacturing precision
If small dimensional filters (1 mm by 1 mm or smaller) are manufactured, then the optical filter can be obtained with desired small size, but chipping may take away a substantial part of the coating or possibly the entire coating
Solution Approach 1:
A protective layer is applied to the optical filter coating before cutting. This preliminary protective measure prevents chipping during the cutting process while allowing the coating to be damaged during manufacturing. The protective layer is subsequently removed after cutting, leaving the coating intact and undamaged.
3Device complexity
If damaged optical filter coating is used with photodiode, then the optical filter can be obtained with reduced complexity, but the photodiode measures other bandwidths and gives incorrect measurement results
Solution Approach 1:
A protective layer is applied to the optical filter coating before cutting. This preliminary protective measure prevents chipping during the cutting process while allowing the coating to be damaged during manufacturing. The protective layer is subsequently removed after cutting, leaving the coating intact and undamaged.
Data Source
AI summary
The invention relates to a method for dicing a substrate coated with an optical filter coating. The first substrate is coated with an optical filter coating configured with a specific spectral sensitivity. The method comprises the steps of: forming a substrate stack by disposing a second substrate over the optical filter coating of the coated substrate such that the optical filter coating forms an interlayer between the first substrate and the second substrate; and dicing the substrate stack into a plurality of individual portions. Each portion comprises a part of the coated substrate and a part of the second substrate with a part of the optical filter coating as an interlayer in between the part of the first substrate and the part of the second substrate. The individual portions may serve as filters of an optical filter system. The optical filter system may be part of an optical measurement device.