Optical Filter Layer Segmentation via Resist Swelling

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Solution Overview

Problem

Conventional processes for producing areally segmented optical filter layers on substrates are complex and sensitive to temperature changes, requiring low substrate temperatures and resulting in mechanical instability and defects in the filter layers.

Innovation Solution

A process involving the application of a resist layer on a substrate, followed by vacuum deposition of an optical filter layer, and subsequent removal of the resist layer by causing it to swell, allowing for higher temperature deposition and improved layer quality and durability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the resist layer is removed by dissolving it, then the removal process is simple, but the process is sensitive to temperature changes and requires low substrate temperatures

Engineering Contradiction:

Improveresist layer removal processVSAvoidsubstrate temperature

Core Design Contradiction:

Ease of manufactureVSTemperature

Solution Approach 1:

The invention changes the removal mechanism from dissolution to swelling by selecting a resist layer composition that swells upon contact with the deposition medium or plasma environment. This parameter change allows the process to tolerate higher substrate temperatures during vacuum deposition, eliminating the temperature constraint while maintaining effective resist removal

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The resist layer undergoes a phase transition from a solid state to a swollen state when exposed to the deposition medium or plasma. This phase change enables the resist to be easily removed after high-temperature vacuum deposition, as the swollen resist layer detaches from the substrate along with the deposited filter layer

Inventive Principle:

Principle #36Phase transitions

2Productivity

If vacuum deposition is performed at higher temperatures, then the deposition rate increases and layer quality improves, but conventional resist removal methods fail due to temperature-induced changes

Engineering Contradiction:

Improvedeposition rateVSAvoidresist layer removal reliability

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The invention modifies the resist layer's chemical composition and physical properties so that its removal mechanism changes from temperature-sensitive dissolution to swelling-based removal. This allows high-temperature vacuum deposition to proceed at higher rates while the resist layer can still be reliably removed through swelling, maintaining both productivity and reliability

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention converts the harmful effect of high temperature on conventional resist removal into a benefit by selecting a resist material that is specifically designed to swell and detach under the deposition conditions. The high temperature that would normally degrade the resist's removability actually enhances the swelling effect, making removal more reliable

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Stability of the object's composition

If conventional cutting and assembly operations are used to produce segmented filter disks, then uniform filter properties can be achieved, but the process becomes complex and requires accurate balancing

Engineering Contradiction:

Improvefilter properties uniformityVSAvoidcutting and assembly process

Core Design Contradiction:

Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The invention performs the segmentation action during the deposition process itself by using a mask with pre-defined segment patterns. The filter layers are deposited directly in their final segmented configuration, eliminating subsequent cutting and assembly operations. This preliminary action ensures uniform filter properties while greatly simplifying the manufacturing process

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The invention extracts the complex cutting and assembly operations from the manufacturing process by depositing the segmented filter layers directly in the desired configuration using a patterned mask. This leaves only the essential deposition step, removing the need for mechanical segmentation and assembly operations

Inventive Principle:

Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This process enables the production of denser, more stable optical filter layers that are less sensitive to temperature changes, reducing defects and enhancing chemical resistance and production efficiency.

Implementation Method 1

the resist layer with the optical filter layer thereon is removed by causing the resist layer to swell

Methodology Applied

Scientific EffectSwelling:

Implementation Method 2

an optical filter layer is deposited on the surface by vacuum deposition

Methodology Applied

Scientific EffectVacuum deposition: Physical Vapour Deposition

Data Source

PatentUS7704683B2Process for producing patterned optical filter layers on substrates

Publication Date: 2010.04.27 SCHOTT AG

AI summary

The invention provides a process for producing at least one optical filter layer segment on a substrate. The process includesapplying a masking comprising a resist layer on a surface of the substrate,depositing an optical filter layer on the surface and the resist layer by vacuum deposition, andremoving the resist layer with a portion of the optical filter layer thereon from the surface.The deposition of the optical filter layer, at least at times, takes place at a temperature of over 150° C., preferably in a range from over 150° C. up to and including 400° C.