Optical Filter Substrate Bonding for Parallelism Control

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Solution Overview

Problem

Existing optical filters, such as Fabry-Perot Etalon filters, face challenges in maintaining precise parallelism and controlling the gap between optical films, leading to inclination issues during substrate bonding, which affects wavelength resolution and precision.

Innovation Solution

The optical filter design incorporates a support portion on one substrate with a bonding film covering its entire surface, ensuring stable attachment and minimizing inclination by using a second bonding film on the opposing substrate, allowing for precise control of the gap between optical films.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If bonding films are used to bond substrates, then substrate attachment is achieved, but substrate inclination occurs due to misalignment and edge effects

Engineering Contradiction:
Improvesubstrate attachment stabilityVSAvoidsubstrate parallelism
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent introduces a support portion as an intermediary structure between the first and second substrates. This support portion provides a stable bonding base that distributes bonding forces evenly, preventing substrate inclination during the bonding process while maintaining reliable substrate attachment.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent segments the bonding structure by introducing a support portion that divides the bonding function into distinct regions: the support portion provides structural stability and parallelism, while the bonding films provide attachment. This segmentation allows each component to optimize its function without interfering with the other.

Inventive Principle:
Principle #1Segmentation

2Measurement precision

If gap control is improved for wavelength resolution, then precision is enhanced, but substrate inclination occurs during bonding process

Engineering Contradiction:
Improvewavelength resolutionVSAvoidgap control precision
Core Design Contradiction:
Measurement precisionVSManufacturing precision

Solution Approach 1:

The support portion is prepared in advance on the first substrate before bonding the second substrate. This preliminary action ensures that the bonding interface is pre-established with proper alignment and parallelism, enabling precise gap control to be maintained throughout the bonding process without substrate inclination.

Inventive Principle:
Principle #10Preliminary action

3Ease of manufacture

If bonding films are activated and positioned, then substrate bonding is achieved, but slight inclination occurs on substrates

Engineering Contradiction:
Improvebonding process feasibilityVSAvoidsubstrate alignment
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The support portion acts as a mediator during the bonding process, providing a stable reference plane that facilitates accurate positioning and alignment of the substrates. This intermediary structure enables the bonding process to proceed easily while maintaining high manufacturing precision and preventing substrate inclination.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS9921402B2Optical filter, method of manufacturing optical filter, and optical instrument
Publication Date: 2018.03.20 SEIKO EPSON CORP
  • US9921402B2 patent drawing
  • US9921402B2 patent drawing
  • US9921402B2 patent drawing

AI summary

An optical filter includes a first substrate which has a support portion, a second substrate which is supported by the support portion, a first optical film which is provided on the first substrate, and a second optical film which is provided on the second substrate to face the first optical film. The first substrate and the second substrate are fixed to each other by bonding a first bonding film which is provided on the entire region of a support surface of the support portion supporting the second substrate and a second bonding film which is provided on at least a region (opposing surface) facing the entire region of the support surface from a supported surface of the second substrate.