Optical Filter Vibration Isolation via Single-Point Fixing

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Solution Overview

Problem

Existing optical filter devices experience a decrease in resolution due to vibration-induced distortion, as external disturbances transmit through the base substrate to the interference filter, affecting the gap dimension and uniformity of reflective surfaces.

Innovation Solution

An optical filter device design where one place on the substrate is fixed to the base section using a fixing member, creating a gap between the substrate and the base section, preventing vibration transmission and maintaining the resolution of the interference filter by altering the stress direction and using a low elasticity fixing member for elastic deformation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stress or pressure

If one place of the interference filter is fixed to the base substrate using adhesive, then the adhesive stress can be decreased, but vibration from external disturbance is transmitted to the interference filter via the base substrate, causing resolution to decrease

Engineering Contradiction:
Improveadhesive stressVSAvoidresolution of interference filter
Core Design Contradiction:
Stress or pressureVSMeasurement precision

Solution Approach 1:

A vibration isolation structure is introduced as an intermediary between the base substrate and the interference filter. This mediator prevents vibration transmission from the base substrate to the interference filter while maintaining the fixed connection, thus resolving the contradiction between reducing adhesive stress and preventing vibration-induced resolution degradation.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The physical parameters of the connection between the base substrate and interference filter are changed by introducing a vibration isolation structure with specific mechanical properties (low stiffness in vibration direction, high strength in holding direction). This parameter change allows the system to simultaneously achieve low adhesive stress and vibration isolation, preventing resolution degradation.

Inventive Principle:
Principle #35Parameter changes

2Device complexity

If the interference filter is in contact with the base substrate at one place, then the structure is simple, but when vibration is applied, the vibration is transmitted to the interference filter, causing gap dimension changes and distortion

Engineering Contradiction:
Improvefixing structure complexityVSAvoidgap dimension uniformity
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The vibration isolation structure serves as a mediator that decouples the mechanical connection between the base substrate and interference filter. It maintains the simple single-point fixing structure while preventing vibration transmission, thus preserving gap dimension uniformity and preventing distortion without increasing structural complexity.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The vibration isolation structure provides beforehand cushioning by being pre-installed between the base substrate and interference filter. It is designed to absorb and dampen vibrations before they can reach the interference filter, preventing gap dimension changes and distortion in advance while maintaining structural simplicity.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

3Ease of manufacture

If adhesive is used to fix the interference filter to the base substrate, then the fixing is simple, but the adhesive contraction during curing causes stress that affects the interference filter

Engineering Contradiction:
Improvefixing process easeVSAvoidtensile stress from adhesive contraction
Core Design Contradiction:
Ease of manufactureVSStress or pressure

Solution Approach 1:

The vibration isolation structure acts as an intermediary that is positioned between the adhesive and the interference filter. It absorbs the tensile stress generated by adhesive contraction during curing, preventing this stress from being transmitted to the interference filter while maintaining the simplicity of the adhesive fixing process.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The mechanical properties of the connection system are changed by introducing the vibration isolation structure with appropriate elasticity and damping characteristics. This parameter change allows the system to accommodate adhesive contraction stress without transmitting it to the interference filter, maintaining both ease of manufacture and low stress.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively prevents distortion and maintains the resolution of the interference filter by isolating it from external vibrations, ensuring accurate light transmission and detection in optical modules and electronic apparatus.

Implementation Method 1

a fixing member which fixes one place of the substrate to the base section, wherein a surface which is on other place of the one place of the substrate and the base section are disposed with a gap therebetween

Methodology Applied
Scientific EffectElastic deformation: Elasticity

Data Source

PatentUS11493748B2Optical filter device, optical module, and electronic apparatus
Publication Date: 2022.11.08 SEIKO EPSON CORP
  • US11493748B2 patent drawing
  • US11493748B2 patent drawing
  • US11493748B2 patent drawing

AI summary

An optical filter device includes a wavelength variable interference filter that includes a pair of reflective films which face each other, and a fixed substrate in which one of the pair of reflective films is provided; a base to which the fixed substrate is fixed; and a fixing member which fixes one place on the fixed substrate to the base, a surface which is on other place of the one place of the substrate and the base are disposed with a gap therebetween.