Optical Fingerprint Sensing Unit Packaging via UV-Cured Adhesive
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Solution Overview
Problem
The conventional process of packaging optical fingerprint sensing units is complex, making mass production difficult.
Innovation Solution
A method involving a fixture with positioning posts, optically clear adhesives, and a fiber-optic plate is used to create an encapsulation layer around optical fingerprint sensing chips, allowing for efficient packaging and subsequent cutting into individual units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional packaging process is used, then packaging can be completed, but the process is very complicated and mass production is difficult
Solution Approach 1:
The packaging process is divided into distinct sequential steps: coating optically clear adhesive on the first substrate, bonding the optical fingerprint sensing chip, coating adhesive on the second substrate, bonding the fiber-optic plate, and curing. This segmentation allows each step to be optimized independently and facilitates automation for mass production.
Solution Approach 2:
Optically clear adhesive is coated on the substrates before bonding the optical components. This preliminary preparation ensures proper adhesion and positioning, simplifying the overall packaging process and enabling consistent quality across mass production.
2Reliability
If optical fingerprint sensing chips are packaged individually, then each unit is protected, but the packaging process becomes complex and time-consuming
Solution Approach 1:
Multiple optical fingerprint sensing chips are packaged simultaneously on a single substrate using the same adhesive coating and bonding process. This merging approach provides uniform protection to all chips while significantly reducing total packaging time compared to individual packaging.
Solution Approach 2:
The adhesive coating, bonding, and curing processes are performed continuously across multiple chips without interruption. This continuous operation maintains protective coverage for all chips while maximizing production efficiency and minimizing time loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the packaging process, enabling mass production of optical fingerprint sensing units while maintaining their functionality and durability.
Implementation Method 1
the first optically clear adhesive and the second optically clear adhesive are imprinted and light-cured, so that an encapsulation layer is formed
Implementation Method 2
a fiber-optic plate is provided. The fiber-optic plate includes a second positioning hole
Data Source
AI summary
An optical fingerprint sensing unit includes a substrate, a circuit pattern, an optical fingerprint sensing chip, an encapsulation layer and a fiber-optic layer. The circuit pattern is formed on a surface of the substrate. The optical fingerprint sensing chip is fixed on the substrate. The optical fingerprint sensing chip is electrically connected with the circuit pattern through a metal wire. The optical fingerprint sensing chip, the circuit pattern and the metal wire are covered by the encapsulation layer. The fiber-optic layer is disposed on the encapsulation layer. After a UV-curable optically clear adhesive is subjected to a light-curing reaction, the encapsulation layer is formed.