Semiconductor Optical Gain Section Layout for Heat Dissipation
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Solution Overview
Problem
Existing semiconductor optical devices face challenges in effectively dissipating heat generated during operation, leading to temperature rise and deterioration of device characteristics.
Innovation Solution
A semiconductor optical device design incorporating a substrate with a recess and a wiring line that extends from a gain section mesa to the recess, utilizing layers with varying thermal conductivities to facilitate heat dissipation, including a high thermal conductivity first layer and an insulating second layer, with the recess extending through these layers to enhance heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional substrate structure without recess is used, then the device structure is simple, but heat dissipation is insufficient leading to temperature rise
Solution Approach 1:
The substrate structure is modified by adding a recess that extends in the thickness direction (vertical dimension), creating a three-dimensional heat dissipation path. This vertical dimension allows heat to be conducted more efficiently from the gain section through the high thermal conductivity first layer to the recess region, improving heat dissipation without significantly increasing lateral device complexity
Solution Approach 2:
The substrate is segmented into multiple functional layers with different thermal conductivities: a high thermal conductivity first layer for heat conduction, an insulating second layer for thermal isolation, and a third layer containing the optical waveguide. This segmentation allows optimized thermal management for each functional region
2Reliability
If the wiring line is routed directly over the optical waveguide, then the electrical connection is direct, but optical loss increases due to absorption and scattering
Solution Approach 1:
The wiring line is extracted from the optical path by routing it through the recess region that is spaced from the first mesa. This separates the electrical connection path from the optical transmission path, eliminating optical absorption and scattering losses caused by metal wiring in the waveguide region
Solution Approach 2:
The recess acts as an intermediary structure that enables the wiring line to reach the gain section electrical contact without passing through the optical waveguide region. The recess provides a physical pathway that mediates between the electrical connection requirement and the optical transmission requirement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves heat dissipation by transferring heat generated in the mesa to the substrate, suppressing temperature rise and maintaining device characteristics, thereby enhancing performance and reducing thermal resistance.
Implementation Method 1
a thermal conductivity of the first layer is higher than a thermal conductivity of the second layer... transferring heat generated in the mesa to the substrate
Data Source
AI summary
A semiconductor optical device includes a substrate having an optical waveguide, a gain section formed of a compound semiconductor having an optical gain and bonded to an upper surface of the substrate, the gain section having a first mesa, and a first wiring line electrically connected to the gain section. The first mesa of the gain section is optically coupled to the optical waveguide. The substrate includes a first layer, a second layer, and a third layer. The first layer has a higher thermal conductivity than the second layer. The second layer is stacked on the first layer. The third layer is stacked on the second layer. A recess provided in the substrate extends through the third layer to the second layer in the thickness direction. The first wiring line extends from the first mesa of the gain section to the recess.