Optical Grating Trench Depth Control via Ion Beam Etching

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Solution Overview

Problem

Current methods for forming complex optical gratings are costly and inefficient due to the need for multiple cycles of litho-etching, resulting in increased costs and decreased throughput.

Innovation Solution

A method involving an ion source that delivers an ion beam to a substrate to form optical gratings with varying trench depths along multiple dimensions, using techniques such as ion beam etching, reactive ion beam etching, and chemically assisted ion beam etching to create complex patterns and improve grating performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If multiple cycles of litho-etching are used to form complicated trenches, then manufacturing precision is improved, but productivity deteriorates and cost increases

Engineering Contradiction:
Improvetrench depth precisionVSAvoidmanufacturing throughput
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent segments the trench formation process into distinct depth zones (first depth region and second depth region) that can be formed simultaneously in a single etching cycle. This allows complex multi-depth trench structures to be created without requiring multiple sequential litho-etching cycles, thereby maintaining manufacturing precision while significantly improving productivity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces a mask layer with varying thicknesses (first thickness region and second thickness region) as an additional dimensional parameter to control trench depth. By using the mask layer thickness variation as a control dimension, the process achieves precise depth control for different trench regions in a single etching step, eliminating the need for multiple cycles.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Manufacturing precision

If multiple cycles of litho-etching are used to form complicated trenches, then manufacturing precision is improved, but cost increases

Engineering Contradiction:
Improvetrench depth precisionVSAvoidmanufacturing cost
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent segments the mask layer into regions with different thicknesses, allowing each region to define a specific trench depth. This segmentation enables precise control over trench depths in different areas without requiring multiple expensive litho-etching cycles, thereby maintaining manufacturing precision while reducing overall manufacturing cost.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent changes the mask parameter from uniform thickness to non-uniform thickness (first thickness region and second thickness region). This parameter change in the mask layer directly translates to different trench depths after etching, achieving precise depth control and complex trench geometries in a single process cycle, thus reducing manufacturing cost.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If trench depth is varied in multiple dimensions, then optical grating performance is improved, but device complexity increases

Engineering Contradiction:
Improveoptical grating performanceVSAvoidgrating structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies local quality by creating mask layer regions with different thicknesses (first thickness region and second thickness region) at specific locations. This results in trenches with different depths (first depth region and second depth region) in different areas of the optical grating, allowing optimization of optical performance for specific functions while managing overall device complexity through a single etching process.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for the creation of optical gratings with improved performance, reduced manufacturing costs, and increased throughput by varying trench depths in multiple dimensions, enhancing image quality and reducing downtime.

Implementation Method 1

etching a plurality of trenches into the substrate to form an optical grating

Methodology Applied
Scientific EffectIon beam etching: Sputtering

Implementation Method 2

reactive ion beam etching

Methodology Applied
Scientific EffectReactive ion beam etching: Chemical Bonding

Implementation Method 3

chemically assisted ion beam etching

Methodology Applied
Scientific EffectChemically assisted ion beam etching: Chemical Bonding

Data Source

PatentUS11226439B2System and method for forming surface relief gratings
Publication Date: 2022.01.18 APPLIED MATERIALS INC
  • US11226439B2 patent drawing
  • US11226439B2 patent drawing
  • US11226439B2 patent drawing

AI summary

Optical grating components and methods of forming are provided. In some embodiments, a method includes providing a substrate, and etching a plurality of trenches into the substrate to form an optical grating. The optical grating may include a plurality of angled trenches, wherein a depth of a first trench of the plurality of trenches varies between at least one of the following: a first lengthwise end of the first trench and a second lengthwise end of the first trench, and between a first side of the first trench and a second side of the first trench.