Optical Device Package Vertical Sidewall Groove Miniaturization
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Solution Overview
Problem
The V-shaped grooves used in optical communication devices occupy a large amount of substrate space, hindering the miniaturization of these devices due to their larger aperture dimensions on the surface and greater depth within the substrate.
Innovation Solution
A semiconductor substrate with a profile having a surface roughness greater than the second surface, forming a groove with vertical sidewalls that allows for the secure placement of an optical device, reducing overall space usage and facilitating miniaturization through multi-stage etching processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a V-shaped groove is used to dispose optical fiber, then the optical device can be securely held, but the aperture dimension on the substrate surface and depth in the substrate increase, occupying large substrate space
Solution Approach 1:
The groove formation process is segmented into multiple stages: first forming a trench with vertical sidewalls, then selectively removing substrate material to create the final groove. This segmentation allows achieving both vertical sidewalls for secure holding and reduced substrate occupation.
Solution Approach 2:
The groove structure implements local quality by having vertical sidewalls in specific regions while maintaining a reduced overall footprint. The groove cross-sectional shape is optimized locally to provide secure optical device holding without increasing the substrate area occupied.
2Adaptability or versatility
If a V-shaped groove with larger depth is used, then the optical device can be accommodated, but the substrate space consumption increases, impeding miniaturization
Solution Approach 1:
The invention transitions from a conventional V-shaped groove to a groove with vertical sidewalls, changing the dimensional characteristics from inclined to perpendicular. This dimensional change allows the optical device to be accommodated with reduced lateral space consumption, enabling miniaturization.
Solution Approach 2:
The groove geometry parameters are changed from V-shaped (with inclined sidewalls) to a shape with vertical sidewalls. This parameter change optimizes the balance between device accommodation capability and substrate space consumption.
Data Source
AI summary
An optical device package includes a semiconductor substrate, and an optical device. The semiconductor substrate has a first surface, a second surface different in elevation from the first surface, and a profile connecting the first surface to the second surface. A surface roughness of the profile is greater than a surface roughness of the second surface. The optical device is disposed on the second surface and surrounded by the profile.