Optical Workpiece Handling Calibration for Semiconductor Package Alignment
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Solution Overview
Problem
Modern manufacturing processes rely heavily on human skill and expertise for quality control, alignment, and calibration, which is inefficient and costly.
Innovation Solution
A workpiece handling system with an upper and lower imaging device is used to automatically align and calibrate transfer mechanisms, end effectors, and carriers, utilizing cameras and light sources to determine and compensate for offsets, enabling automated calibration and reducing labor costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If automated workpiece handling systems are implemented, then productivity and manufacturing precision are improved, but device complexity and initial costs increase
Solution Approach 1:
The patent replaces manual mechanical alignment and calibration operations with an automated optical measurement system. Imaging devices capture images of alignment marks, and a controller automatically calculates positions and offsets, substituting human skill-based mechanical adjustment with automated optical-mechanical integration.
Solution Approach 2:
The system performs self-calibration by automatically measuring alignment marks on the carrier and end effector, calculating offsets, and adjusting positioning without requiring external human intervention. The workpiece handling system calibrates itself through the imaging devices and controller working autonomously.
2Manufacturing precision
If manual calibration and alignment processes are used, then device complexity is reduced, but manufacturing precision and time consumption worsen
Solution Approach 1:
Alignment marks are pre-defined on the carrier and end effector before the calibration process. The imaging devices capture these pre-positioned marks, allowing the system to calculate offsets and perform alignment adjustments without time-consuming manual measurement procedures.
Solution Approach 2:
Manual visual inspection and mechanical measurement tools are replaced with automated imaging devices that capture precise positions of alignment marks. The controller automatically processes images to determine carrier and end effector positions, achieving high precision without manual intervention time.
3Measurement precision
If automated imaging and calibration systems are added, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The imaging devices serve multiple functions: capturing alignment marks for calibration, measuring carrier positions, determining end effector offsets, and verifying workpiece placement. This multi-functionality reduces the need for separate specialized devices, managing complexity while maintaining high measurement precision.
Solution Approach 2:
Alignment marks serve as intermediaries between the physical components (carrier, end effector) and the measurement system (imaging devices). These marks provide standardized reference points that the imaging devices can automatically detect and measure, bridging the gap between mechanical components and optical measurement without requiring complex direct measurement mechanisms.
Data Source
AI summary
A workpiece handling system includes a carrier, a lower imaging device, and a transfer mechanism. The carrier is configured to carry at least one workpiece. The lower imaging device is disposed beside the carrier. The transfer mechanism is movably disposed over the lower imaging device and the carrier, wherein the transfer mechanism includes an end effector configured to pick and place the at least one workpiece and an upper imaging device disposed beside the end effector. A method of calibrating a workpiece handling system and a method of manufacturing a semiconductor package are also provided.