Optical HBM Links With Separate Cooling for Dense Memory Packages
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Solution Overview
Problem
The integration of multiple high-bandwidth memory (HBM) dies in a package is limited by space, power, and thermal constraints, hindering high-performance computing.
Innovation Solution
Implementing an optical interface to connect HBM packages with processor packages, allowing for flexible cooling solutions and component placement without sacrificing performance, using distinct cooling units for HBM and processor packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If more HBM dies are integrated in a package to increase bandwidth and capacity, then performance requirements are met, but space constraints, power constraints, and thermal constraints are exceeded
Solution Approach 1:
The patent transitions from traditional electrical interconnects to optical interconnects, representing a dimensional change in the communication medium. This allows HBM packages to be connected via optical fibers, enabling higher bandwidth and capacity without proportionally increasing package space requirements, as optical signals can carry more data over longer distances with less interference.
Solution Approach 2:
The patent divides the cooling function into separate modular cooling units for the HBM package and processor package. This segmentation allows independent thermal management optimization, where the HBM package can be cooled efficiently without being constrained by processor cooling requirements, enabling higher density integration.
2Productivity
If more HBM dies are integrated in a package to increase bandwidth and capacity, then performance requirements are met, but power constraints are exceeded
Solution Approach 1:
The transition to optical interconnects reduces electrical power consumption by eliminating resistive losses in copper traces and reducing signal reflection and interference. Optical signals carry data without the energy dissipation inherent in electrical conductors, enabling higher bandwidth without proportionally increasing power consumption.
3Productivity
If more HBM dies are integrated in a package to increase bandwidth and capacity, then performance requirements are met, but thermal constraints are exceeded
Solution Approach 1:
The patent implements separate cooling units that can be independently designed and optimized for the specific thermal characteristics of the HBM package. This segmentation allows for targeted thermal management, where cooling resources are focused on the HBM dies without being constrained by processor cooling requirements, enabling higher density integration within thermal limits.
Solution Approach 2:
The patent introduces intermediate cooling structures and thermal management components that act as mediators between the high-power HBM dies and the environment. These intermediate cooling units facilitate efficient heat transfer and distribution, allowing the system to handle higher thermal loads from increased HBM integration.
4Adaptability or versatility
If optical interface is implemented to connect HBM packages with processor packages, then flexible cooling solutions and component placement are enabled, but device complexity increases
Solution Approach 1:
The patent introduces optical interconnects as a new dimensional approach to package communication, replacing traditional electrical traces. This enables greater design freedom in component placement and cooling configuration, as optical fibers can be routed independently of electrical signal paths, allowing more flexible thermal and electrical design optimization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient heat transfer and component arrangement, facilitating high-performance computing while accommodating varying datacenter requirements and enabling scalable upgrades.
Implementation Method 1
an optical interface configured to convert electrical signals to optical signals and transmit the optical signals to the processor package via the one or more optical fibers
Implementation Method 2
one or more cooling components configured to transfer heat from the first set of components of the plurality of HBM assemblies
Data Source
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AI summary
The technology generally relates to high bandwidth memory (HBM) packages and processor packages that have optical connectivity. Disclosed systems and methods herein allow for HBM dies that are interconnected with an optical interface in a manner that allows for compact, high-performance computing. An HBM package can be cooled using a cooling unit that is distinct from the processor package. In addition, the cooling unit can be configured so as to provide thermal contact with a subset of high-power components within the HBM package.