High Density Optical Header Modular Alignment
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Solution Overview
Problem
Existing technologies face challenges in simultaneously connecting multiple optical fibers/waveguides to electronic/optical systems with high reliability and flexibility due to the need for precise passive and active alignment, the fragility of optical fibers, and matching wave guidance values with system interfaces.
Innovation Solution
A high density optical packaging header apparatus providing configurable, modular, and versatile solutions with active and passive alignment features, utilizing optical fiber waveguides with specific transverse refractive index distributions and longitudinal diameter profiles to connect optical components in various configurations, including angled transitions and flexible fiber arrangements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple optical fibers/waveguides are connected to electronic/optical systems, then connection capacity is improved, but alignment precision requirement increases
Solution Approach 1:
The header apparatus divides the connection task into modular segments by providing individual alignment features for each optical fiber/waveguide connection point. Each connection location has dedicated alignment mechanisms that can be independently adjusted and positioned, allowing precise alignment of multiple fibers without requiring perfect alignment across the entire array.
Solution Approach 2:
The patent introduces intermediary alignment features such as alignment pins, V-grooves, and positioning holes that mediate between the optical fibers/waveguides and the backplane connections. These intermediary elements provide reference surfaces and mechanical constraints that simplify the alignment process and maintain precision across multiple connections.
2Productivity
If multiple optical fibers/waveguides are connected simultaneously, then connection capacity is improved, but system complexity increases
Solution Approach 1:
The header apparatus employs universal design elements that can accommodate different types of optical fibers and waveguide configurations through a single integrated structure. The modular header block can be configured for various applications by simply changing the fiber array arrangement while maintaining the same basic connection mechanism and alignment features.
Solution Approach 2:
The patent combines multiple connection functions into a single integrated header apparatus that simultaneously provides alignment, mechanical support, and electrical/optical connection capabilities. By merging these functions into one component rather than separate assemblies, the overall system complexity is reduced despite handling multiple fibers.
3Ease of operation
If optical fibers are made flexible for easier connection, then ease of operation is improved, but fiber fragility increases
Solution Approach 1:
The header apparatus incorporates flexible structural elements such as flexible positioning channels and adaptable mounting structures that allow the optical fibers to be routed and positioned with ease while maintaining mechanical protection. The flexible nature of these structural components enables easy connection without compromising fiber integrity.
Solution Approach 2:
The patent provides beforehand protection by incorporating protective structures such as padded channels, reinforced routing paths, and cushioning elements that protect the fragile optical fibers from mechanical stress during installation and operation. These protective measures are built into the header structure prior to fiber installation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reliable and flexible connections of multiple optical fibers to optical-fiber-based systems, reducing bend loss and enhancing compatibility with diverse system interfaces, while maintaining the integrity of optical fibers through precise alignment and adaptable configurations.
Implementation Method 1
optical fiber waveguides with specific transverse refractive index distributions and longitudinal diameter profiles
Implementation Method 2
transverse refractive index distribution for use in configuring least one optical fiber waveguide
Data Source
AI summary
The inventive high density optical packaging header apparatus, in various embodiments thereof, provides configurable, modular, and highly versatile solutions for simultaneously connecting multiple optical fibers/waveguides to optical-fiber-based electronic systems, components, and devices, and is readily usable in a variety of applications involving highly flexible and modular connection of multiple optical fibers/waveguides assembled in a header block configuration to optical-fiber-based system/component backplanes, while providing advantageous active and passive alignment features.