Optically Heated Substrate Support With Removable Optical Fibers
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Solution Overview
Problem
Conventional electronic device manufacturing systems face challenges in achieving precise temperature control across substrates during high-temperature processing, leading to uneven deposition and processing anomalies due to small temperature variations.
Innovation Solution
The implementation of a substrate support assembly with embedded optical fibers that deliver heat through channels in a ceramic or metal plate, allowing for pixelated and zonal temperature control, which can be used alone or in conjunction with resistive heating, to maintain temperatures above 200°C to 650°C, and enabling flexible temperature tuning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If resistive heaters are used for heating, then heating function is provided, but temperature uniformity across substrate deteriorates
Solution Approach 1:
The heating system is segmented into multiple independent optical heating zones, each controlled by individual optical fibers or fiber groups. This allows independent temperature control of different substrate regions, enabling precise temperature uniformity across the entire substrate surface, which resolves the temperature uniformity issue while maintaining processing precision
Solution Approach 2:
Optical fibers are strategically positioned to provide localized heating at specific substrate regions. The system enables different temperature profiles for different zones of the substrate, achieving superior temperature uniformity and control precision that cannot be obtained with conventional uniform resistive heating
2Temperature
If optical fibers are embedded in substrate support, then temperature control precision is improved, but device complexity increases
Solution Approach 1:
The optical fiber bundle serves multiple functions: heating the substrate, enabling temperature monitoring through fiber-optic sensors, and providing structural support. This multi-functionality reduces the need for separate components, thereby managing device complexity while achieving precise temperature control
Solution Approach 2:
Optical fibers act as intermediaries that transmit optical energy from external laser sources to the substrate support. This indirect heating method allows precise temperature control without direct electrical contact, simplifying the thermal control architecture while maintaining high precision
3Ease of repair
If optical fibers are made removable, then ease of repair is improved, but device complexity increases
Solution Approach 1:
Optical fibers are extracted from permanent embedding and made removable through designed access channels and retention mechanisms. This allows individual fibers to be removed and replaced without replacing the entire substrate support assembly, significantly improving ease of repair while the modular design keeps the added complexity manageable
Solution Approach 2:
The system enables selective replacement of only the faulty optical fiber(s) while retaining functional fibers. This partial replacement approach minimizes waste, reduces repair time and cost, and manages device complexity by maintaining the majority of the original functional components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides improved temperature uniformity and control across substrates, allowing for precise heating and cooling, reducing processing anomalies and enhancing the quality of high-temperature processes like PECVD, while also enabling the refurbishment of optical fibers for extended system life.
Implementation Method 1
heating may be provided by resistive heaters provided within the pedestal... The plurality of optical fibers may be used to provide light-based heating
Implementation Method 2
heating may be provided by resistive heaters provided within the pedestal
Data Source
AI summary
A substrate support includes a plate comprising a top surface and a bottom surface, wherein the top surface is to support a substrate. The plate further comprises an electrode, one or more resistive heating elements, a first plurality of channels, and a plurality of optical fibers in the first plurality of channels, wherein the plurality of optical fibers are removable from the substrate support.