Optical Heating Layout Shielding LEDs From Flash Lamp Damage
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Solution Overview
Problem
Conventional optical heating devices using halogen lamps for preheating semiconductor substrates face issues with LED element damage due to direct exposure to high-energy flash lamp light, and inefficiencies in power consumption and lifespan.
Innovation Solution
An optical heating device design incorporating flash lamps and LED elements, where a light blocking member is used to prevent direct exposure of LED elements to flash lamp light, allowing LED elements to preheat the substrate without damage, and enabling compact configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If halogen lamps are used for preheating, then the semiconductor substrate can be heated uniformly, but the preheating speed is slow and power consumption is high
Solution Approach 1:
The patent replaces halogen lamps with LED elements for preheating, substituting a thermal radiation-based heating system with a more efficient light-emitting diode system. This substitution achieves faster preheating speed while reducing power consumption, directly resolving the technical contradiction between heating efficiency and energy usage.
Solution Approach 2:
The patent changes the operating parameters by using LED elements that emit specific wavelengths optimized for semiconductor substrate heating. This parameter change enables more efficient energy conversion and faster heating response compared to traditional halogen lamps, addressing both the speed and power consumption aspects of the contradiction.
2Productivity
If LED elements are placed in the flash lamp irradiation space, then preheating efficiency increases, but the LED elements are damaged by high-energy flash lamp light
Solution Approach 1:
The patent divides the heating system into two distinct functional zones: a preheating zone with LED elements and a main heating zone with flash lamps. By spatially segmenting the irradiation spaces, the LED elements can operate efficiently without being exposed to damaging flash lamp light, thus maintaining both preheating efficiency and LED durability.
Solution Approach 2:
The patent introduces a light blocking member as an intermediary element that selectively blocks high-energy flash lamp light from reaching the LED elements while allowing the LED preheating light to reach the semiconductor substrate. This intermediary protects the LED elements from damage while maintaining preheating functionality.
3Speed
If flash lamps are used for instant heating, then the heating speed increases, but the semiconductor substrate may warp or crack due to sudden temperature variation
Solution Approach 1:
The patent applies preliminary action by using LED elements to preheat the semiconductor substrate before the flash lamps are activated. This preheating step gradually raises the substrate temperature, reducing the thermal shock when flash lamps are subsequently applied, thereby preventing warping and cracking while maintaining fast heating capability.
Solution Approach 2:
The patent ensures continuous useful action by maintaining LED preheating throughout the flash lamp heating process. This continuous preheating provides a stable thermal foundation that allows the flash lamps to heat the substrate rapidly without causing sudden temperature variations that would lead to structural damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents LED element damage, enhances preheating speed, reduces power consumption, and extends device lifespan while maintaining uniform heating of semiconductor substrates.
Implementation Method 1
a plurality of LED elements for emitting light from outside a flash light irradiation space
Implementation Method 2
optical heating device for heating a substrate
Implementation Method 3
the flash lamps 102 emit light toward the semiconductor substrate W1 with high energy enough to instantaneously heat the main surface of the semiconductor substrate W1 to 1000° C. or higher
Implementation Method 4
a light blocking member disposed between the flash lamp and a plurality of the LED elements in a separating direction, and outside the flash light irradiation space, for blocking the light emitted from the flash lamp and traveling toward a plurality of the LED elements
Implementation Method 5
the semiconductor substrate suddenly expands and contracts in accordance with the temperature variation, which may cause the semiconductor substrate to warp and crack
Data Source
AI summary
An optical heating device for heating a substrate includes:a chamber for accommodating the substrate;a support member for supporting the substrate in the chamber;a flash lamp disposed to face a first main surface of the substrate supported by the support member;a plurality of LED elements for emitting light from outside a flash light irradiation space that is sandwiched between the substrate supported by the support member and the flash lamp, the light traveling toward the first main surface of the substrate or a second main surface of the substrate that is the opposite side of the first main surface; anda light blocking member disposed between the flash lamp and a plurality of the LED elements in a separating direction, and outside the flash light irradiation space, for blocking the light emitted from the flash lamp and traveling toward a plurality of the LED elements.