Optical Height Measurement Assembly for 3D Printing Z-Axis Compensation

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Solution Overview

Problem

Existing numerical control apparatuses face challenges in achieving stable and reliable height measurement with high precision and low cost, particularly in three-dimensional printing, where Z-axis precision is critical for preventing over-extrusion or under-extrusion issues that affect printing quality.

Innovation Solution

A height measurement method using a photoelectric signal collection array, light source, and lens, which constructs a preset height acquisition model through movement distances and reflected light patterns, enabling accurate target height calculation and quality compensation by adjusting printing flow based on measured heights.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If encoder on electric motor or grating ruler on Z axis is used for height measurement, then measurement precision is improved, but device cost increases

Engineering Contradiction:
Improveheight measurement precisionVSAvoiddevice cost
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent replaces mechanical measurement systems (encoder on electric motor or grating ruler on Z axis) with an optical measurement system using light source, lens, and photoelectric signal collection array. This substitution achieves high measurement precision while avoiding the high cost and complexity of mechanical encoders and grating rulers.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces an optical intermediary system (light source, lens, and photoelectric array) to measure height indirectly by detecting light pattern changes rather than directly measuring mechanical displacement. This intermediary approach provides precise measurement without requiring expensive mechanical measurement components.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Device complexity

If contact switch is mounted on processing actuator or fixing frame for height measurement, then device cost is reduced, but processing head interferes with workpiece generation position

Engineering Contradiction:
Improvedevice costVSAvoidinterference with workpiece generation position
Core Design Contradiction:
Device complexityVSObject-affected harmful factors

Solution Approach 1:

The patent uses light as an intermediary to perform height measurement without physical contact between the processing head and workpiece generation position. The optical system measures height by detecting light pattern changes, eliminating the interference problem associated with mounting contact switches on the processing actuator.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent replaces the mechanical contact switch system with an optical measurement system. This substitution eliminates the need for physical contact and complex mechanical structures while avoiding interference with the workpiece generation position.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Device complexity

If inductive or capacitive proximity sensors are used for height measurement, then device cost is reduced, but measurement reliability deteriorates due to requirements on plane properties

Engineering Contradiction:
Improvedevice costVSAvoidmeasurement reliability
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent replaces inductive or capacitive proximity sensors with an optical measurement system using light source, lens, and photoelectric array. This substitution eliminates the sensitivity to plane properties that plagues proximity sensors, providing reliable measurements across various surface types while maintaining low device cost.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the measurement parameter from electrical field interaction (inductive/capacitive sensors) to optical interaction (light reflection). This parameter change makes the measurement system reliable regardless of the electrical or magnetic properties of the measured plane, overcoming the limitations of proximity sensors.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method improves measurement efficiency and precision, reduces costs, and prevents interference issues, providing reliable height measurements and enhanced printing quality by compensating for height errors in real-time.

Implementation Method 1

a photoelectric signal collection array, a light source, a lens... light emitted out by the light source irradiating a plane to be measured of an assembly to be measured, and the lens being configured for focusing the light emitted out by the light source

Methodology Applied
Scientific EffectPhotoelectric Effect: Photoelectric Effect

Data Source

PatentUS20240094699A1Height measurement method, quality compensation method, and height measurement system based on height measurement assembly of numerical control apparatus
Publication Date: 2024.03.21 MOXIN (HUZHOU) TECH CO LTD
  • US20240094699A1 patent drawing
  • US20240094699A1 patent drawing
  • US20240094699A1 patent drawing

AI summary

A height measurement method, quality compensation method, and height measurement system based on a height measurement assembly of a numerical control apparatus. The height measurement method includes driving the height measurement assembly to move on a coordinate axis of the numerical control apparatus through a preset positioning mechanism on a plane to be measured of an assembly to be measured, so as to obtain a preset movement distance corresponding to each movement; acquiring reflected light patterns of several planes to be measured through a photoelectric signal collection array in each movement process, and acquiring a distance between adjacent reflected light patterns through a processing portion; and acquiring a target height of the assembly to be measured through a preset height acquisition model according to each preset movement distance and the distance between adjacent reflected light patterns corresponding to each preset movement distance.