Optical Semiconductor Housing Package Assembly
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional packages for housing optical semiconductor elements require excessive time and effort for assembly due to the complexity of bonding opposite end faces together.
Innovation Solution
A package design featuring a base body with an optical semiconductor element mounting portion, a frame body surrounding the mounting portion, and an optical fiber securing member fitted in a through hole at the juncture of the frame body, with continuous joining material between the frame body and the optical fiber securing member, and a seal ring with a groove to enhance bonding and hermeticity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the frame body is formed by bending a strip-like metal plate and bonding end faces together, then the frame body can be constructed with good mechanical strength, but extra time and effort are required for assembly
Solution Approach 1:
The patent combines the frame body formation and optical fiber securing member installation into a single integrated structure. The through hole is formed directly during the bending process of the strip-like metal plate, eliminating the need for separate assembly steps for both components.
Solution Approach 2:
The strip-like metal plate is designed to serve multiple functions simultaneously: it forms the frame body structure, creates the through hole for optical fiber securing, and provides bonding surfaces for joining. This multi-functionality reduces the number of separate components and assembly operations required.
2Device complexity
If the through hole is provided at the juncture of bonded end faces, then the optical fiber securing member can be integrated into the frame body, but the bonding process becomes more complex
Solution Approach 1:
The through hole is formed in advance during the bending process of the strip-like metal plate, before the bonding of end faces. This preliminary formation of the through hole eliminates the need for complex post-bonding operations to create the opening for the optical fiber securing member.
Solution Approach 2:
The strip-like metal plate is bent at specific positions to create distinct segments that form the frame body structure, with the through hole positioned at the juncture of bonded end faces. This segmentation allows for systematic formation of the complex structure through controlled bending and bonding operations.
3Reliability
If joining material is continuously interposed at the juncture and between the optical fiber securing member, then bondability is improved, but the manufacturing process requires additional steps
Solution Approach 1:
The joining material is applied continuously at the juncture of bonded end faces and between the optical fiber securing member and frame body, creating an uninterrupted bonding path. This continuous application ensures consistent bondability and eliminates weak points that would arise from discontinuous bonding.
Solution Approach 2:
The patent combines multiple bonding operations into a single integrated process step, where the joining material simultaneously bonds the end faces of the frame body and secures the optical fiber securing member in place, reducing the total number of manufacturing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces assembly steps, improves bondability, suppresses thermal stress, and maintains hermeticity, resulting in a package that is easier to assemble and more reliable in operation with enhanced sealing performance and reduced risk of connection failures.
Implementation Method 1
The frame body 22 is attached to the base body 21 by means of brazing with a brazing material such as Ag (silver) solder
Implementation Method 2
a joining material is continuously interposed in both of the juncture of the frame body and a region between an outer peripheral surface of the optical fiber securing member, and the one end side and the other end side
Implementation Method 3
a seal ring with a groove to enhance bonding and hermeticity
Implementation Method 4
The base body 21 is made of a metal having good thermal conductivity such as copper-tungsten for example
Implementation Method 5
The recess 22b and the projection 22c act to disperse a tensile stress developed in the frame body 22 due to the difference in thermal expansion coefficient between the frame body 22 and the base body 21
Data Source
Figure 1~2A
Figure 2B~3A
Figure 3B
AI summary
An optical semiconductor element housing package includes a base body (1) having an optical semiconductor element mounting portion (1a) on an upper main surface thereof; a frame body (2) joined to the base body (1) so as to surround the mounting portion (1a); and an optical fiber securing member (3) fitted in a through hole (2c) which penetrates through from an inside to an outside of the frame body (2). The frame body (2) is formed by bending a single strip-like plate member at its several positions, and then bonding one end (2a) side and an other end (2b) side thereof, the through hole (2c) being provided so as to be located at a juncture of the one end (2a) side and the other end (2b) side. By bonding with the interposition of the optical fiber securing member (3) fitted in the through hole (2c), an easy optical semiconductor element housing package characterized by easy assembling and a uniform joining force is obtained.