Optical IC Package Housing for PCB Alignment Without Size Growth
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Solution Overview
Problem
Conventional optical IC packages are enlarged due to mechanical alignment features needed to attach them to a PCB, which complicates their integration and increases size.
Innovation Solution
An intermediate structural carrier, such as a housing, is used to align both the electrical and optical interfaces of an optical IC, allowing for a durable and efficient mechanical and electrical coupling to an external PCB through an electrical interconnect.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If mechanical alignment features are added to attach optical IC to PCB, then reliability of attachment is improved, but package size increases
Solution Approach 1:
The patent combines the mechanical alignment features and electrical interconnect functions into a single integrated electrical interconnect structure. This eliminates the need for separate mechanical alignment features, achieving reliable attachment while minimizing package size expansion.
Solution Approach 2:
The electrical interconnect is designed to serve multiple functions simultaneously: providing electrical connection, mechanical support, and optical alignment reference. This multi-functionality reduces the need for additional dedicated alignment features that would increase package size.
2Ease of manufacture
If mechanical alignment features are added to attach optical IC to PCB, then ease of assembly is improved, but device complexity increases
Solution Approach 1:
By merging alignment and electrical connection functions into one component, the patent reduces the total number of parts and assembly steps. The electrical interconnect serves as both the electrical pathway and the mechanical alignment reference, simplifying the overall package structure.
Solution Approach 2:
The electrical interconnect acts as an intermediary structure that mediates between the optical IC and PCB, providing both electrical connection and mechanical alignment in a single element. This eliminates the need for separate alignment features and reduces assembly complexity.
Data Source
AI summary
An example apparatus includes: an integrated circuit including a first surface and terminals; a package including: a housing around the integrated circuit, the housing exposing the first surface; and an electrical interconnect including a second surface and an opening, the second surface electrically coupled to the terminals, the second surface mechanically coupled to the housing, the opening configured to expose the first surface.