Optical IC Package Eliminating Wire Bonding via Light-Transmissive Vias
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Solution Overview
Problem
Conventional integrated circuit packaging methods are inefficient and costly, requiring wire bonding and ball grid array formation, which can be bypassed by using optical elements for data communication and eliminating the need for these processes.
Innovation Solution
An integrated circuit die with optical elements on one major surface, encapsulated in a resin body and connected via light-transmissive vias to a support element, which interfaces with optical fibers for data communication, eliminating the need for wire bonding and ball grid array formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional wire bonding and ball grid array formation are used, then reliable electrical connections are achieved, but packaging complexity and cost increase
Solution Approach 1:
The patent replaces the mechanical wire bonding process with direct optical coupling between the optical element and fiber optic cable. The optical element is positioned in registration with the fiber optic cable to establish direct optical communication, eliminating the need for wire bonds and ball grid arrays while maintaining reliable connections.
Solution Approach 2:
The invention extracts and removes the wire bonding and ball grid array formation processes from the packaging methodology. By using optical elements that directly couple with fiber optic cables, the patent eliminates these intermediate electrical connection components, simplifying the overall packaging structure.
2Ease of manufacture
If wire bonding and ball grid array formation are performed, then electrical connectivity is established, but manufacturing cost and process time increase
Solution Approach 1:
The patent substitutes the multi-step mechanical processes of wire bonding and ball grid array formation with a single optical coupling operation. The optical element is positioned in registration with the fiber optic cable during encapsulation, dramatically reducing manufacturing steps and associated time costs.
Solution Approach 2:
The invention merges the optical coupling function with the encapsulation process. The optical element is positioned and secured within the encapsulant material in a single operation, combining what would traditionally be separate steps of electrical connection formation and packaging into one integrated process.
3Device complexity
If optical elements are used for data communication, then packaging complexity is reduced, but new manufacturing requirements are introduced
Solution Approach 1:
The patent applies local quality by creating a specific registration structure within the encapsulant material that ensures precise positioning of the optical element. This localized structural feature provides the necessary alignment guidance without requiring high-precision positioning throughout the entire packaging process.
Solution Approach 2:
The invention incorporates preliminary action by pre-forming registration structures within the encapsulant material before inserting the optical element. These pre-formed guides and alignment features ensure that when the optical element is positioned, it automatically achieves the correct registration with the fiber optic cable, reducing the precision burden on the final positioning step.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient data communication through optical channels, reducing packaging costs and complexity by eliminating the need for wire bonding and ball grid array formation, while providing a compact and reliable integrated circuit package.
Implementation Method 1
data communication to circuitry of the integrated circuit die can be effected using a data channel implemented using the plurality of optical elements
Implementation Method 2
The die is encapsulated in a resin body, which joins it to a laminar support element
Implementation Method 3
A plurality of vias (through-holes, or elements of light-transmissive material) are formed through the support element, in register with respective ones of the elements optical elements
Data Source
AI summary
An integrated circuit package includes an integrated circuit die 1 having a plurality of optical elements 5 sensitive to and/or capable of generating light, whereby data communication to circuitry of the integrated circuit die can be effected using a data channels implemented using the plurality of elements. The data channels are along optical pathways provided by an adapter unit 17 mounted on a PCB 19. The adapter unit 17 forms the optical pathways between optical fibers 23 and the respective optical element 5. Thus, there is no requirement to implement expensive wire-bonding as part of the packaging process.