Optical IC Package Waveguide Integration
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Solution Overview
Problem
The limitations of electrical signal transmission in downscaling and increasing speed in electronic devices due to the constraints of copper interconnection lines necessitate the development of high-speed signal transmission methods, such as using optical signals.
Innovation Solution
An optical integrated circuit (IC) package is designed, comprising an optical IC substrate with an electrical integrated circuit device, optical devices, optical and electrical interfaces, and an encapsulation member, which facilitates both optical and electrical connections to enhance signal transmission speed and device performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If electrical signals are transmitted through copper interconnection lines, then electrical connection is achieved, but transmission speed is limited and cannot meet downscaling and acceleration needs
Solution Approach 1:
The patent replaces electrical signal transmission through copper interconnection lines with optical signal transmission through optical waveguides. This substitution of transmission medium (from electrical to optical) enables significantly higher transmission speeds while maintaining connection reliability, directly resolving the contradiction between speed and reliability in signal transmission.
2Device complexity
If optical devices are integrated on the same substrate as electrical circuits, then device complexity is reduced, but optical signal interference with electrical signals may occur
Solution Approach 1:
The patent introduces optical waveguides as intermediary structures that physically separate optical signal transmission from electrical circuit operations. The waveguides act as dedicated optical channels that prevent electromagnetic interference between optical devices and electrical circuits, enabling safe integration on the same substrate while maintaining signal integrity.
Solution Approach 2:
The patent creates distinct functional zones on the substrate: regions with optical waveguides for optical signal transmission and regions with copper interconnection lines for electrical signals. This spatial separation with specialized local properties prevents interference while maintaining overall system integration, resolving the contradiction between reduced complexity and signal interference prevention.
3Speed
If optical waveguides are formed on the substrate, then optical signal transmission is enabled, but manufacturing precision requirements increase
Solution Approach 1:
The patent combines the formation of optical waveguides with existing semiconductor manufacturing processes, integrating optical structure fabrication into the standard device fabrication flow. This merging of processes leverages existing precision manufacturing capabilities while adding optical transmission functionality, reducing the burden of separate high-precision optical fabrication.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The optical IC package enables efficient optical and electrical signal transmission, facilitating the downscaling and acceleration of electronic devices by leveraging optical interfaces and waveguides for improved signal quality and transmission speed.
Implementation Method 1
an optical waveguide extending from the optical device to the optical interface
Data Source
AI summary
An optical integrated circuit (IC) package includes an optical IC including an optical IC substrate, an optical IC including an optical IC substrate, an electrical integrated circuit device (EICD) on the optical IC substrate, at least one optical device spaced apart from the EICD on the optical IC substrate, an optical interface on a first side of the optical IC substrate, an electrical interface located on a second side of the optical IC substrate, and an encapsulation member configured to encapsulate the optical IC, the EICD, the at least one optical device, the optical interface, and the electrical interface.