Optical Imaging Device Connection Unit for Thermal Stability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing microlithographic imaging devices face challenges in maintaining long-term geometric stability due to issues with pretensioning forces, fretting effects, and thermal expansion, which can lead to misalignment and costly recalibration.
Innovation Solution
A two-part connection unit comprising a main body and an insert is used, where the main body is adapted to the component in terms of thermal expansion, and the insert is designed to work with high-strength tensioning units, allowing for increased pretensioning forces without increasing installation space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional threaded inserts with adhesive bonding are used to connect components, then the connection can be established, but fretting effects occur during tightening that subject the adhesive bond to high load and can result in failure
Solution Approach 1:
The connection unit is divided into a threaded insert and a separate bracing element that can be independently optimized. The threaded insert handles thread engagement while the bracing element provides structural support and distributes loads, preventing fretting at the adhesive interface.
Solution Approach 2:
The bracing element acts as an intermediary between the threaded insert and the component, transferring and distributing forces to reduce stress concentration and prevent fretting effects that would otherwise directly affect the adhesive bond.
2Strength
If high-strength tensioning units are used to increase pretensioning forces, then connection strength is improved, but the installation space requirement increases
Solution Approach 1:
The bracing element is designed to be partially received within the component's receiving structure, nesting the support function within the existing component geometry. This allows high-strength tensioning units to be implemented without proportionally increasing the overall installation space footprint.
3Ease of manufacture
If the coefficient of thermal expansion of the connection unit differs from the component, then manufacturing is simplified, but thermal expansion mismatches cause stresses during temperature changes
Solution Approach 1:
The bracing element is designed with specific geometric parameters (thickness, length, material properties) that can be adjusted to compensate for thermal expansion differences. By optimizing these parameters, the connection unit can accommodate thermal cycling without generating excessive stresses, even when the overall CTE differs from the component.
4Manufacturing precision
If tolerance factors for optical element positions are made more stringent to achieve high imaging accuracy, then imaging quality is improved, but the complexity of maintaining these tolerances increases
Solution Approach 1:
The bracing element provides preemptive structural support that cushions and maintains the spatial relationship between optical components throughout operation. This prior cushioning against deformation and displacement helps maintain stringent tolerance requirements without requiring complex active compensation systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves a stable connection between components, reducing the risk of relative movements and displacements, and maintaining high imaging accuracy over the system's lifetime.
Implementation Method 1
The insert is inserted in a receiving cutout in the main body and connected to the main body in order to transfer forces in the tensioning direction
Implementation Method 2
the main body is adapted to the component in terms of thermal expansion
Data Source
AI summary
An arrangement of a microlithographic imaging device includes a first component, a second component and a connection unit of a connection device. The connection unit is configured to cooperate with the first component in a connection region between the first and second components. The connection unit is configured to cooperate, in a mounted state, with a tensioning unit of the connection device in a tensioning direction. The tensioning unit cooperates with the second component to connect the first and second component to one another in the connection region. The connection unit includes a main body. The insert is inserted in a receiving cutout in the main body and connected to the main body to transfer forces in the tensioning direction. The insert is configured to cooperate with the tensioning unit to connect the first and second components to one another in the connection region.


