Optical Imaging Apparatus Support Segmentation for EUV Assembly
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Solution Overview
Problem
The increasing demand for higher numerical aperture in optical imaging systems for semiconductor fabrication leads to challenges such as reduced line-of-sight accuracy, increased optical element size, and complex support structures, which complicates assembly and introduces vibration and thermal issues, necessitating a solution to maintain imaging accuracy and simplify assembly.
Innovation Solution
The optical imaging apparatus is divided into separate primary and auxiliary support sub-structures, which are assembled as individual modules and temporarily connected to form mechanically decoupled support structures, allowing for easier assembly and maintenance of imaging accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If high numerical aperture reflective systems are used in EUV range to achieve enhanced resolution, then imaging accuracy is improved, but support structure complexity increases
Solution Approach 1:
The support structure is divided into separate support devices, each independently supporting individual optical elements. This segmentation allows each support device to be optimized separately, reducing overall complexity while maintaining the precision required for high NA EUV imaging systems
2Measurement precision
If larger optical elements are used to increase numerical aperture, then resolution is improved, but vibration and thermal disturbances increase
Solution Approach 1:
Optical elements are supported by individual support devices rather than a single large support structure. This segmentation isolates vibration and thermal disturbances to local areas, preventing them from affecting the entire system and maintaining imaging precision despite using large optical elements for high NA
Solution Approach 2:
Each support device is designed with specific local properties optimized for its supported optical element, allowing tailored vibration damping and thermal management at each location while maintaining overall system resolution
3Measurement precision
If complex support structures are used to maintain line of sight accuracy, then imaging precision is improved, but assembly difficulty increases
Solution Approach 1:
The system is assembled from modular support devices that can be independently manufactured and tested before final integration. This modular approach simplifies the assembly process while maintaining the complex precision requirements for line of sight accuracy through standardized interfaces and alignment features
Data Source
AI summary
An optical imaging apparatus includes an optical element support sub-structure and an auxiliary support sub-structure. The optical element support sub-structure is configured to support an optical element and has a first temporary support interface arrangement. The optical element is configured to form part of a group of optical elements of the optical imaging apparatus configured to transfer, in an exposure process using exposure light, an image of a pattern of a mask onto a substrate. The auxiliary support sub-structure is configured to support an auxiliary component and has a second temporary support interface arrangement. The auxiliary component is configured to execute, during the exposure process, an auxiliary function of the exposure process other than transferring the image of the pattern onto the substrate.