Optical Input Device Stacked Die Integration
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Solution Overview
Problem
Conventional optical input devices, such as optical mice, are limited by the size constraint of their chip modules due to the placement and manufacturing method of the light emitting diode, sensor unit, and control unit, restricting their applications.
Innovation Solution
The optical input device employs a stack packaging technique to mount a light source die on a detecting die, integrating a light source die with a processor and control circuit to generate light for light sensing elements, reducing the device's size and broadening its applications through improved design and integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional packaging methods are used to package the LED, sensor unit, and control unit, then the structural complexity is reduced, but the chip module size cannot be reduced
Solution Approach 1:
The patent merges the LED, sensor unit, and control unit into a single integrated chip module package, combining multiple functional components that were previously packaged separately. This integration reduces the overall chip module size while maintaining all necessary functions through unified packaging structure
Solution Approach 2:
The patent employs a nested packaging structure where the control unit is packaged within the same package housing as the LED and sensor unit. The package contains multiple sub-components arranged in a nested configuration, with the wire layer connecting these nested elements, achieving compact size reduction
2Adaptability or versatility
If the LED, sensor unit, and control unit are packaged together, then the structure is simplified, but the size constraint limits applications
Solution Approach 1:
The patent transitions from a planar arrangement of components to a three-dimensional stacked configuration within the package. The LED, sensor unit, and control unit are arranged in vertical layers with wire connections routing signals between dimensions, enabling compact integration that reduces footprint while maintaining functionality for diverse applications
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces the size of the optical input device, allowing for easier integration into various electronic products and enhancing sensing accuracy, thereby expanding its range of applications and simplifying manufacturing.
Implementation Method 1
a light source die mounted on the detecting die and electrically coupled to the processor of the detecting die for generating light for the light sensing elements to detect
Implementation Method 2
The sensor unit 5 converts the light into corresponding image signals and transmits the image signals to the control unit 7
Data Source
AI summary
A light source die of an optical input device is mounted on a detecting die of the optical input device in order to reduce the size of the optical input device. The light source die emits light to a reflective surface, and light sensing elements formed on the detecting die sense the reflected light from the reflective surface. A control circuit of the optical input device generates corresponding navigation signals according to the output signals of the light sensing elements.