Optical Inspection Unit for Precise Component Transfer on Opaque Substrates
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Solution Overview
Problem
Current systems for transferring electronic components face challenges in precision and throughput, especially when using non-transparent substrates, as they require complex setups and cannot handle miniaturized components effectively without compromising assembly accuracy.
Innovation Solution
A device and method that utilize a system with inspection units to accurately position and transfer components onto multi-row web substrates, allowing for precise alignment and higher throughput by detecting assembly positions directly on the substrate, enabling the use of both transparent and untransparent materials without loss of quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If complex inspection systems are used to achieve precise positioning of electronic components, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
A marker is introduced as an intermediary element on the substrate to enable indirect detection of the substrate's position and orientation. The marker serves as a reference object that simplifies the inspection process by providing easily detectable features (edges, corners) that can be used to calculate the substrate's precise location without requiring complex direct measurement of the entire substrate.
Solution Approach 2:
The position and orientation information is captured optically and processed to create digital position data that represents the physical substrate's state. This copying of physical information into digital form allows for precise positioning control without requiring continuous complex mechanical measurement systems.
2Manufacturing precision
If traditional transfer methods are used to handle electronic components, then device complexity is kept low, but manufacturing precision deteriorates due to inability to handle miniaturized components
Solution Approach 1:
The patent replaces complex mechanical positioning and alignment systems with an optical inspection and measurement system. Instead of using精密 mechanical guides and alignment mechanisms, the system uses optical detection of markers to determine substrate position and orientation, then uses this information to control the transfer process, thereby reducing mechanical complexity while improving precision for miniaturized components.
3Reliability
If non-transparent substrates are used to protect electronic components, then component protection is improved, but inspection precision deteriorates due to inability to see through substrate
Solution Approach 1:
The marker serves as an intermediary that carries the position information externally on the substrate surface. Instead of trying to see through the non-transparent substrate to detect position, the system detects the marker's position which is visible from above, and uses this information to infer the substrate's position and orientation. This allows both protection (non-transparent substrate) and precise inspection (visible marker).
4Productivity
If high throughput is achieved by increasing transfer speed, then productivity is improved, but manufacturing precision deteriorates due to reduced time for precise positioning
Solution Approach 1:
The system performs preliminary optical inspection and position detection of the substrate and components before the actual transfer operation. By detecting marker positions and calculating substrate orientation in advance, the system prepares precise positioning data that enables fast, accurate transfer without requiring slow, deliberate mechanical alignment during the transfer itself. This preliminary measurement action allows high speed while maintaining precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly increases throughput and maintains precision in transferring electronic components, allowing for the use of multi-row web materials and eliminating the need for intermediate substrates, thus enhancing the handling of miniaturized components on various substrate types.
Implementation Method 1
A first image data acquisition device is designed to acquire image data of a region, in which the slide is designed to interact with the at least one electronic component, through the first light-permeable area of the housing
Data Source
AI summary
The invention relates to an inspection unit intended for use in devices for transferring electronic components from a first substrate to a second substrate and/or for applying adhesive from a reservoir to the second substrate, comprising an image capturing unit, which is assigned an illumination unit, wherein the illumination unit is designed to direct light of different wavelengths onto a second holder, which in turn is designed to support an object located on the second substrate, which is to be captured by the image capturing unit, wherein a sixteenth, seventeenth, eighteenth and/or nineteenth conveying unit is designed to convey the respective image capturing unit and/or its associated optics, including focussing optics, a beam deflector and/or an illumination unit, along the second holder.