Optical Inspection Position Correction for Electronic Circuits
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Solution Overview
Problem
Optical inspection systems face inaccuracies in detecting the position of electronic circuits due to reflective or opaque materials and irregular shapes, which can lead to incorrect position detection and increased installation time when trying to relocate sensors for reliable measurements.
Innovation Solution
The method involves acquiring images of the electronic circuit using image sensors to determine the offset between the circuit's position and the inspection position, comparing these images with reference images to correct the position, and modifying the circuit's position if necessary, without relying on mechanical, magnetic, or light beam projection sensors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional position sensors (mechanical, magnetic, or light beam projection) are used to detect object position, then the inspection system can control conveyor stopping, but the position detection becomes inaccurate when objects have reflective/opaque materials or irregular shapes
Solution Approach 1:
The patent replaces traditional mechanical, magnetic, or light beam projection position sensors with an optical imaging system using cameras and image processing algorithms. The system captures images of the object and uses computer vision techniques to detect position, eliminating the problems caused by reflective or opaque materials interfering with traditional sensors.
Solution Approach 2:
The system changes the detection parameter from direct position sensing (which fails with certain materials) to image-based feature detection. By analyzing image data and identifying object features through processing, the system achieves accurate position detection regardless of material properties like reflectivity or opacity.
2Measurement precision
If the position sensor is relocated to achieve more reliable position measurements, then measurement accuracy improves, but installation time increases
Solution Approach 1:
The optical imaging system serves multiple functions: it captures images for position detection, provides visual data for inspection, and enables flexible software-based position calculation. This multi-functionality eliminates the need for specialized sensor relocation while achieving reliable position measurements through image processing.
Solution Approach 2:
The system creates a digital representation (image) of the object and its position, then analyzes this copy to determine actual position. This allows position detection without physical contact or specialized sensor placement, reducing installation complexity and time while maintaining measurement reliability.
3Adaptability or versatility
If image sensors are used to detect object position through image acquisition and processing, then adaptability to different objects improves and installation time is reduced, but the system complexity increases
Solution Approach 1:
The system uses the object's own visual features detected in images to determine its position. The image processing algorithms automatically identify relevant features and calculate position without requiring external calibration or complex additional components, allowing the system to adapt to different objects while managing complexity through self-contained processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for accurate position correction and efficient optical inspection by using image sensors to adapt to the circuit's material and shape, reducing installation time and avoiding sensor relocation, thus improving the reliability and speed of the inspection process.
Implementation Method 1
acquisition of images of the electronic circuit by image sensors
Data Source
AI summary
The invention concerns a method of optical, inspection of an electronic circuit (Card) including the acquisition of images of the electronic circuit by image sensors (C), the use of the images to determine the offset between the position of the electronic circuit (Card) and an inspection position, and the use of said images in at least another step of the method.