Optical Integration Device Side Surface Concavity Convex Member
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Solution Overview
Problem
The small contact area between the circuit layer and the metal sheet in optical integration devices leads to fractures, disrupting electrical connections and causing the devices to malfunction in 3D face recognition applications.
Innovation Solution
The optical integration device incorporates a side surface with concavities and convex members in the connecting pads, which increase the contact area with conductive members, enhancing the electrical connection stability between the circuit layers and pads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the circuit layer is connected with the pad through a metal sheet, then electrical connection is achieved, but the small contact area causes fractures and connection instability
Solution Approach 1:
The patent transitions from a planar 2D contact interface to a 3D multi-dimensional contact structure by introducing concavities on the side surface and corresponding convex members. This dimensional change allows the conductive member to engage with the circuit layer through multiple contact points (bottom surface and side walls), dramatically increasing the effective contact area and mechanical interlocking without expanding the footprint area.
Solution Approach 2:
The convex member of the conductive member is inserted into the concavity formed on the side surface of the integration device, creating a nested structure. The conductive member's convex portion fits within the recessed concavity, establishing a mechanically interlocked connection that prevents fracture and maintains electrical connectivity under stress.
2Device complexity
If the contact area between circuit layer and metal sheet is small, then device structure remains compact, but fractures occur easily disrupting electrical connection
Solution Approach 1:
The patent utilizes the vertical dimension by forming concavities on the side surface and creating convex members that extend into these concavities. This approach increases connection reliability through enhanced mechanical interlocking without expanding the device's horizontal footprint, thereby maintaining structural compactness while improving connection stability.
Solution Approach 2:
The concavity is formed locally on the side surface at specific positions rather than modifying the entire structure. This localized modification creates targeted mechanical interlocking zones where convex members engage with concavities, providing enhanced connection reliability only where needed while preserving the overall compact device structure.
Data Source
AI summary
An optical integration device includes a first circuit layer comprising a first surface adjacent a first diffractive layer, the first diffractive layer arranged on a side of the first circuit layer along a first direction, and a first connecting pad electrically connected with the first circuit layer through a first conductive member. The optical integration device includes a side surface extending along the first direction. The side surface defines a first concavity extending through the first diffractive layer along the first direction. The first connecting pad includes a first mounting member connected with the side surface, and a first convex member extending from the first mounting member and received in the first concavity. The first conductive member includes a first conductive part arranged between the side surface and the first mounting member, and a second conductive part arranged between the first surface and the first convex member.