Optical Interconnects for Composite Processor Energy Efficiency

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Solution Overview

Problem

Highly integrated processors are costly and difficult to manufacture, leading to increased production costs and limitations in developing custom or application-specific processors, as well as inefficiencies in energy utilization and performance due to interconnection speed and latency limitations between separate processor units.

Innovation Solution

The development of optically-enabled composite processors, where multiple processor element packages are coupled via direct optical interconnects, allowing for customized and application-specific processor designs without the need for full-scale processor manufacturer cooperation, by using optical links to communicate between processor element packages without intermediary opto-electronic elements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If multiple processor units are highly integrated on a single substrate, then interconnection speed improves, but manufacturing cost and difficulty increase

Engineering Contradiction:

Improveinterconnection speedVSAvoidmanufacturing cost and difficulty

Core Design Contradiction:

SpeedVSEase of manufacture

Solution Approach 1:

The processor system is divided into multiple separate processor units that can be manufactured independently on different substrates, then combined in a common package. This segmentation allows each unit to be optimized and manufactured separately, reducing the manufacturing complexity and cost while maintaining high interconnection speeds through direct optical interconnects between the separate units.

Inventive Principle:

Principle #1Segmentation

2Speed

If multiple processor units are highly integrated on a single substrate, then interconnection speed improves, but development of custom processors becomes more difficult

Engineering Contradiction:

Improveinterconnection speedVSAvoidcustom processor development

Core Design Contradiction:

SpeedVSAdaptability or versatility

Solution Approach 1:

By segmenting the processor into independent units that communicate via optical interconnects, the system allows different processor types and configurations to be combined flexibly. This enables custom processor development by selecting and integrating specific processor units for particular applications without requiring full-scale manufacturer cooperation.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The optical interconnect interface serves as a universal communication medium between different processor units, allowing diverse processor types to be integrated together. This multi-functional interface enables both high-speed communication and flexible customization of processor configurations for different applications.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Loss of time

If generic processors are selected for use in a product, then development time is reduced, but energy utilization and performance deteriorate

Engineering Contradiction:

Improvedevelopment timeVSAvoidenergy utilization

Core Design Contradiction:

Loss of timeVSUse of energy by moving object

Solution Approach 1:

The processor configuration is made dynamic and adaptable through modular design. Instead of being fixed, the processor can be customized by selecting specific units for particular applications, optimizing energy utilization and performance for each use case while still allowing relatively quick deployment compared to full custom design.

Inventive Principle:

Principle #15Dynamics

4Ease of manufacture

If electrical interconnects are used between processor units, then ease of manufacture is maintained, but energy consumption and latency increase

Engineering Contradiction:

Improveease of manufactureVSAvoidenergy consumption

Core Design Contradiction:

Ease of manufactureVSUse of energy by moving object

Solution Approach 1:

Electrical interconnects are replaced with optical interconnects that use light instead of electrical signals. This substitution reduces energy consumption and latency between processor units while maintaining manufacturability through standard optical coupling techniques and interfaces.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS8929694B2Composite processors

Publication Date: 2015.01.06 HEWLETT PACKARD ENTERPRISE DEV LP

AI summary

In one example, a composite processor includes a circuit board, a first processor element package, and a second processor element package. The circuit board has an optical link and an electrical link. The first processor element package includes a substrate with an integrated circuit, a sub-wavelength grating optical coupler, and an electrical coupler coupled to the electrical link of the circuit board. The second processor element package includes a substrate with an integrated circuit, a sub-wavelength grating optical coupler, and an electrical coupler coupled to the electrical link of the circuit board. The sub-wavelength grating optical coupler of the first processor element package, the optical link of the circuit board, and the sub-wavelength grating optical coupler of the second processor element package collectively define an optical communications path between the substrate of the first processor element package and the substrate of the second processor element package.