Optical Interconnect Substrate Layout With Fewer Through-Holes
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Solution Overview
Problem
The increase in the number of through-holes in interconnect substrates reduces the strength of the core layer, leading to potential breakage and increased safety hazards due to the use of hydrofluoric acid in hole formation.
Innovation Solution
An interconnect substrate design that eliminates or reduces the number of through-holes by using optical signal exchange between photoelectric conversion members on opposite surfaces of a translucent core layer, connected via interconnect layers, allowing for signal transmission without penetrating the core.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of through-holes is increased to provide more interconnect paths, then the interconnect functionality is improved, but the strength of the core layer is reduced
Solution Approach 1:
The patent divides the interconnect function into two separate segments: through-holes for electrical interconnection and surface-mounted photoelectric conversion members for optical signal exchange. This segmentation allows the core layer to maintain structural integrity while still providing comprehensive interconnect functionality through the combination of electrical and optical pathways.
Solution Approach 2:
The patent introduces optical signal exchange as an intermediary mechanism to supplement the electrical interconnect paths. By using photoelectric conversion members that exchange optical signals through the core layer, the system reduces dependence on numerous through-holes, thereby maintaining core layer strength while preserving interconnect versatility.
2Manufacturing precision
If through-holes are formed using hydrofluoric acid to achieve precise hole formation, then the manufacturing precision is improved, but the safety hazards increase
Solution Approach 1:
The patent extracts the critical interconnect function from the through-hole formation process by implementing surface-mounted photoelectric conversion members. This extraction reduces the number of through-holes required, thereby minimizing the use of hydrofluoric acid and the associated safety hazards while maintaining manufacturing precision for the reduced set of through-holes.
Solution Approach 2:
The patent replaces permanent through-hole interconnections with surface-mounted photoelectric conversion members that can be easily installed and replaced. This approach reduces the need for precise, permanent through-hole formation using hazardous chemicals, as the optical interconnects can be established through simpler surface mounting processes.
3Adaptability or versatility
If the number of through-holes is increased to enhance interconnect capability, then the device complexity increases, but the production costs increase due to increased chemical usage
Solution Approach 1:
The patent segments the interconnect implementation into electrical through-holes and optical surface-mounted components. This segmentation allows for reduced through-hole formation, decreasing chemical usage and production costs, while the optical components provide the necessary interconnect capability through non-contact optical signal exchange.
Solution Approach 2:
The patent replaces the mechanical/chemical process of forming numerous through-holes with optical signal exchange between surface-mounted photoelectric conversion members. This substitution eliminates the need for extensive chemical processing, thereby reducing production costs while maintaining or enhancing interconnect capability through optical pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the core layer's strength, reduces the risk of breakage, decreases the use of hazardous chemicals, and lowers production costs by minimizing through-hole formation.
Implementation Method 1
a first photoelectric conversion member disposed on a first surface of the core layer, a first interconnect layer electrically connected to the first photoelectric conversion member, a second photoelectric conversion member disposed on a second surface of the core layer that is opposite the first surface, and a second interconnect layer electrically connected to the second photoelectric conversion member, wherein the first photoelectric conversion member and the second photoelectric conversion member are arranged at such positions as to exchange optical signals with each other through the core layer
Data Source
AI summary
An interconnect substrate includes a core layer that is translucent, a first photoelectric conversion member disposed on a first surface of the core layer, a first interconnect layer electrically connected to the first photoelectric conversion member, a second photoelectric conversion member disposed on a second surface of the core layer that is opposite the first surface, and a second interconnect layer electrically connected to the second photoelectric conversion member, wherein the first photoelectric conversion member and the second photoelectric conversion member are arranged at such positions as to exchange optical signals with each other through the core layer.