Optical Interconnect Module Layout for High-I/O Data Processing
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Solution Overview
Problem
Electrical signals struggle to provide sufficient input/output capacity across the limited size of a practically viable electronic chip package, especially in data processing servers, as they are unable to meet the increasing demands of data centers.
Innovation Solution
Implementing an optical interconnect module with a photonic integrated circuit and serializer/deserializer modules to convert optical signals to electrical signals and vice versa, allowing for efficient data processing and transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electrical signals are used for data transmission in chip packages, then the system structure remains simple, but the input/output capacity becomes insufficient
Solution Approach 1:
The patent replaces electrical signal transmission with optical signal transmission by integrating photonic integrated circuits that convert electrical signals to optical signals for data transmission. This substitution enables higher input/output capacity by utilizing optical fibers instead of traditional electrical conductors, directly resolving the bottleneck of electrical signal capacity limitations in chip packages.
Solution Approach 2:
The patent introduces optical fibers as an intermediary medium between data processing units to transmit optical signals. The photonic integrated circuits act as intermediaries that convert electrical signals to optical signals and vice versa, enabling high-capacity data transmission while maintaining compatibility with existing electrical interfaces.
2Productivity
If optical signals are used for data transmission, then the data processing capacity increases, but the device complexity increases due to additional conversion modules
Solution Approach 1:
The patent merges the photonic integrated circuit with the electronic circuit board by mounting the photonic integrated circuit directly on the circuit board. This integration combines optical conversion functionality with the existing electrical infrastructure, reducing the need for separate conversion modules and minimizing additional device complexity while maximizing data processing capacity.
Solution Approach 2:
The photonic integrated circuit performs multiple functions: it converts electrical signals to optical signals for transmission, converts received optical signals back to electrical signals, and interfaces with both optical fibers and electrical circuit boards. This multi-functionality eliminates the need for separate conversion devices, thereby increasing data processing capacity without proportionally increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances data processing capacity and efficiency by utilizing optical signals to overcome the limitations of electrical signals in chip packages, enabling high-speed data transmission and processing.
Implementation Method 1
a photonic integrated circuit configured to generate a plurality of first serial electrical signals based on the received optical signals
Data Source
AI summary
A system includes a housing and a first circuit board positioned inside the housing. The housing has a top panel, a bottom panel, a left side panel, a right side panel, a front panel, and a rear panel. The front panel is at an angle relative to the bottom panel in which the angle is in a range from 30 to 150°. The first circuit board has a length, a width, and a thickness, in which the length is at least twice the thickness, the width is at least twice the thickness, and the first circuit board has a first surface defined by the length and the width. The first surface of the first circuit board is at a first angle relative to the bottom panel in which the first angle is in a range from 30 to 150°. The first surface of the first circuit board is substantially parallel to the front panel or at a second angle relative to the front panel in which the second angle is less than 60°. The system includes a first data processing module and a first optical interconnect module both electrically coupled to the first circuit board. The optical interconnect module is configured to receive first optical signals from a first optical link, convert the first optical signals to first electrical signals, and transmit the first electrical signals to the first data processing module.