Optical Interconnect Device Hybrid Signal Routing
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Solution Overview
Problem
Existing optical interconnect devices face challenges in reducing connection loss between optical components and waveguides, and in efficiently transmitting data signals between semiconductor integrated circuits and external apparatuses.
Innovation Solution
The optical interconnect device comprises a first substrate with an electrical-optical converter, a light emitting device, and an electrical wiring circuit, connected via an optical waveguide to a second substrate with an optical-electrical converter and a light receiving device, along with an electrical wiring and a switching device that determines signal transmission paths, optimizing data transmission through both optical and electrical means.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If mechanical alignment method is used to align optical component and optical waveguide, then connection loss between them is reduced, but alignment precision and manufacturing complexity are increased
Solution Approach 1:
The patent applies preliminary action by pre-forming alignment marks on the substrate before mounting optical components. The alignment marks are created during substrate processing, and the optical components are subsequently mounted based on these pre-established marks, enabling precise alignment without complex real-time adjustment mechanisms
Solution Approach 2:
The patent uses alignment marks as an intermediary element between the substrate and optical components. These marks serve as a reference medium that facilitates precise positioning and alignment, acting as a mediator that translates design specifications into physical alignment without requiring direct measurement or complex mechanical adjustment
2Speed
If only electrical wiring is used for data transmission, then device complexity is reduced, but transmission speed is limited
Solution Approach 1:
The patent segments data transmission into two distinct channels: electrical wiring for general-purpose and lower-speed communication, and optical waveguide for high-speed data transmission. This segmentation allows each transmission medium to be optimized for its specific function, with the optical path handling bandwidth-intensive traffic while electrical paths handle control and lower-speed data
Solution Approach 2:
The patent transitions from a single-dimensional electrical transmission approach to a multi-dimensional transmission system by adding the optical dimension. The optical waveguide provides a parallel transmission dimension that operates independently from electrical wiring, enabling simultaneous data transmission through multiple modalities with different speed characteristics
3Loss of energy
If 3D optical waveguide is formed to connect light emitting device and light receiving device, then connection loss is reduced, but manufacturing process complexity is increased
Solution Approach 1:
The patent applies preliminary action by pre-forming the 3D optical waveguide structure within the substrate before mounting optical components. The waveguide is created using sequential deposition and etching processes that establish the optical path in advance, allowing subsequent component mounting to simply connect to the pre-formed waveguide endpoints
Solution Approach 2:
The patent merges the optical waveguide formation process with the substrate manufacturing process. The waveguide is integrated into the substrate structure through combined deposition and etching steps, rather than being a separate post-processing addition. This merging reduces the number of discrete manufacturing steps and integrates optical functionality into the base substrate
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces connection loss and enhances data transmission efficiency by precisely aligning optical components and using a 3D optical waveguide to connect light emitting and receiving devices, allowing for fast optical and slow electrical signal transmission.
Implementation Method 1
an electrical-optical converter which is connected to the electrical wiring circuit and converts an electrical signal to an optical signal
Implementation Method 2
an optical-electrical converter which is connected to the electrical wiring circuit of the second substrate and converts the optical signal to the electrical signal
Implementation Method 3
The optical waveguide optically connects the light emitting device and the light receiving device
Data Source
AI summary
An optical interconnect device includes a first substrate, a second substrate, an optical waveguide, an electrical wiring and a switching device. The first substrate has an electrical wiring circuit, an electrical-optical converter for converting an electrical signal to an optical signal, and a light emitting device for emitting a light. The second substrate has an electrical wiring circuit, an optical-electrical converter for converting the optical signal to the electrical signal, and a light receiving device for receiving the light from the light emitted device. The optical waveguide optically connects the light emitting and light receiving devices. The electrical wiring electrically connects the electrical wiring circuits of the first and second substrates. The switching device determines a fast signal of data to be transmitted via the optical substrate and a slow signal of data to be transmitted via the electrical wiring.