Optical Interconnect Isolation via Memory Region Reallocation
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Solution Overview
Problem
MicroLEDs face challenges in achieving high efficiency and low energy consumption due to sidewall defects during manufacturing, which impact their performance in high-bandwidth optical interconnects, particularly in AI data centers.
Innovation Solution
Implementing magnesium (Mg) passivation on the sidewalls of MicroLEDs to neutralize surface states and create a depletion region, reducing non-radiative recombination and enhancing carrier lifetime, combined with a microcavity structure for improved light confinement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If MicroLEDs are scaled down in size for high-density optical interconnects, then device density and integration are improved, but sidewall defects increase causing reduced efficiency and higher energy consumption
Solution Approach 1:
The patent applies magnesium passivation specifically to the sidewalls of MicroLEDs, creating a localized depletion region that addresses surface state defects only where they occur. This targeted approach improves carrier confinement and reduces non-radiative recombination at the sidewalls without affecting the overall device structure, thereby maintaining efficiency even as device size decreases
Solution Approach 2:
The patent combines magnesium passivation layer with the MicroLED structure to create a composite device. The magnesium layer forms a depletion region that acts as an additional barrier against carrier leakage, while the microcavity structure modifies the optical field distribution. This composite approach addresses the sidewall defect issue and improves overall device efficiency at scaled dimensions
2Volume of moving object
If MicroLEDs are scaled down in size, then device density is improved, but manufacturing precision and defect control become more difficult
Solution Approach 1:
The magnesium passivation is applied specifically to the sidewall regions where defects occur during scaling. This localized treatment addresses manufacturing precision issues at the critical sidewall interfaces without requiring complete redesign of the entire fabrication process, making it feasible to manufacture scaled-down devices with controlled defect levels
Solution Approach 2:
The patent converts the harmful sidewall defects into a beneficial structure by using magnesium to create a controlled depletion region. Instead of trying to completely eliminate sidewall defects which become more prevalent at smaller scales, the invention harnesses these defects to form a functional depletion region that actually improves carrier confinement and device performance
3Productivity
If MicroLEDs are scaled down for high-bandwidth applications, then data transfer capability is improved, but carrier lifetime and modulation speed become harder to maintain
Solution Approach 1:
The magnesium passivation creates a localized depletion region at the sidewalls that specifically addresses carrier leakage issues. This localized carrier confinement extends the effective carrier lifetime in the active region, enabling maintained modulation speeds even in scaled-down devices designed for high-bandwidth applications
Solution Approach 2:
The combination of magnesium passivation layer and microcavity structure creates a composite system where the magnesium provides electrical carrier confinement extending lifetime, while the microcavity provides optical field confinement enhancing modulation efficiency. This composite approach maintains both carrier lifetime and modulation speed requirements for high-bandwidth applications
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The Mg passivation and microcavity structure enable MicroLEDs to maintain high efficiency and modulation speed while scaling down in size, achieving low energy consumption and high data transfer rates suitable for AI data centers.
Implementation Method 1
Implementing magnesium (Mg) passivation on the sidewalls of MicroLEDs to neutralize surface states and create a depletion region, reducing non-radiative recombination and enhancing carrier lifetime
Implementation Method 2
combined with a microcavity structure for improved light confinement
Implementation Method 3
MicroLEDs face challenges in achieving high efficiency and low energy consumption due to sidewall defects during manufacturing, which impact their performance in high-bandwidth optical interconnects
Data Source
AI summary
Examples described herein relate to a first interface coupled to a first optical interconnect and coupled to a first memory region of a memory; a second interface coupled to a second optical interconnect and coupled to a second memory region of the memory; and circuitry, coupled to the first interface and the second interface. In some examples, the circuitry is to apply a configuration to determine whether to propagate signals from the first interface and propagate signals from the second interface, based on a determination to permit propagation of signals from the first interface to the first memory region, provide access to the first memory region, and based on a determination to permit propagation of signals from the second interface to the second memory region, provide access to the second memory region.