Optical Interconnect Line Card Registration for Scalable Switch Fabric

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Solution Overview

Problem

Current router configurations face limitations in scalability due to restrictions on line card and switch fabric card deployment, leading to poor integration, high power demand, and large occupied areas, with existing mechanisms requiring line cards to be housed in specific chassis and having limited geographical flexibility.

Innovation Solution

A board registration method that allows for optical interconnection between line cards and switch fabric cards using silicon photonic chips, enabling flexible deployment without the need for a chassis or cabinet, and allowing for remote optical interconnection, thereby increasing throughput and scalability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If multiple line cards are deployed in one line card chassis to meet throughput requirements, then throughput is improved, but the occupied area and device complexity increase

Engineering Contradiction:

ImprovethroughputVSAvoidoccupied area

Core Design Contradiction:

ProductivityVSArea of stationary object

Solution Approach 1:

The patent transitions from electrical interconnection to optical interconnection, enabling line cards to be connected across different physical locations and chassis. This dimensional change in interconnection methodology allows throughput scaling without proportionally increasing occupied area, as optical fibers can span greater distances with minimal space requirements compared to electrical backplanes.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The system is segmented into independent line card chassis that can be remotely deployed and interconnected optically. Each chassis operates semi-independently, allowing flexible placement and scaling without requiring all components to be housed in a single large chassis, thereby reducing the concentrated occupied area while maintaining high throughput.

Inventive Principle:

Principle #1Segmentation

2Adaptability or versatility

If remote deployment of line card chassis is implemented through optical interconnection, then geographical flexibility is improved, but integration of line cards is reduced and the chassis becomes heavier

Engineering Contradiction:

Improvegeographical flexibilityVSAvoidintegration

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent replaces mechanical/electrical interconnection systems with optical interconnection systems. This substitution enables remote deployment and geographical flexibility by using optical fibers that can transmit signals over longer distances with lower attenuation, while the integration complexity is managed through standardized optical interfaces and protocols.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Adaptability or versatility

If an optical module is equipped to each line card chassis for remote deployment, then geographical flexibility is improved, but the chassis weight increases

Engineering Contradiction:

Improvedeployment position flexibilityVSAvoidchassis weight

Core Design Contradiction:

Adaptability or versatilityVSWeight of stationary object

Solution Approach 1:

The optical interconnection capability is extracted as a separate, modular component that can be selectively deployed. Rather than making all chassis heavy with optical modules, the system allows optical interconnection to be implemented only where remote deployment is required, separating the optical functionality from the basic chassis structure and enabling flexible weight optimization.

Inventive Principle:

Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach breaks through chassis and geographical restrictions, enhancing deployment efficiency, reducing heat dissipation issues, and increasing throughput by allowing flexible placement and remote interconnection of line cards and switch fabric cards, while maintaining existing optical interconnect paths.

Implementation Method 1

The fabric interface chip may be optically interconnected to the switch fabric chip by using an optical fiber

Methodology Applied

Scientific EffectOptical interconnection: Optical Fibre

Data Source

PatentEP3506562B1Method for registering single board, single board, and forwarding device

Publication Date: 2023.03.01 HUAWEI TECH CO LTD

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Figure 2-1(a)~2-3

AI summary

A board registration method, a board, and a forwarding device are disclosed. The board includes a line card and a switch fabric card. The line card includes a fabric interface chip, and the fabric interface chip is optically interconnected to a switch fabric chip in at least one switch fabric card by using an optical fiber. An optical cross-connect device may further be added between the fabric interface chip and the switch fabric chip, and the optical cross-connect device, the fabric interface chip, and the switch fabric chip are all optically interconnected to each other by using an optical fiber. A line card registration method includes: obtaining, by the line card, line card information of the line card; and sending, by the line card, the line card information to the at least one switch fabric card through an optical interconnect path, so that the at least one switch fabric card registers the line card based on the line card information. The method can break through restrictions of a chassis or cabinet and a deployment position, thereby quickly completing deployment.