Optical Interconnect for Quantum Computing Thermal Noise
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Solution Overview
Problem
Current quantum computing systems face challenges in thermal/signal management, signal noise mitigation, and packaging form factor due to the need for efficient delivery of electromagnetic control signals to qubits at cryogenic temperatures while minimizing heating and noise, and accommodating a large number of signals in a compact package.
Innovation Solution
An all-optical interface system using optical fiber cables and 3D optical structures with waveguides to convert and route electromagnetic signals to and from qubit packages, reducing thermal noise and heat transfer through the use of low-thermal-conductivity optical fibers and cascaded NIS refrigerators for localized cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If electromagnetic control signals are delivered through conventional electrical wiring to qubits at cryogenic temperatures, then signal delivery is achieved, but excessive heating occurs in the mixing chamber
Solution Approach 1:
The patent replaces conventional electrical wiring with optical fiber cables to deliver control signals to qubits. Optical fibers transmit signals as light rather than electrical currents, eliminating resistive heating in the cryogenic environment. The optical interface converts electrical signals from room temperature to optical signals that can be transmitted through the fiber to the qubits without thermalizing the wiring at each temperature stage.
Solution Approach 2:
The patent introduces an optical interface system as an intermediary between the room-temperature control system and the cryogenic qubits. This interface includes optical-to-microwave converters and waveguide structures that translate optical signals into microwave signals for qubit control, allowing signal transmission without direct electrical connections through the temperature gradient.
2Object-affected harmful factors
If attenuation is used to reduce in-band thermal noise at each temperature stage, then noise mitigation is improved, but signal amplitude decreases
Solution Approach 1:
The patent replaces the conventional approach of electrical attenuation with optical signal transmission. By transmitting control signals as optical signals through fiber cables to the cryogenic stage and then converting to microwave signals, the system avoids the need for multiple attenuation stages. The optical transmission itself does not generate thermal noise, and the conversion process preserves signal integrity without requiring progressive attenuation.
3Adaptability or versatility
If the number of control wires is increased to accommodate more qubits, then qubit control capability is improved, but packaging complexity and form factor increase
Solution Approach 1:
The patent employs a single optical fiber cable that serves multiple functions: it carries both control signals to the qubits and readout signals from the qubits. The optical interface system handles signal conversion for both directions, eliminating the need for separate wiring harnesses for control and measurement, thereby reducing packaging complexity while maintaining full functionality.
Solution Approach 2:
The patent merges multiple signal pathways into a single optical fiber infrastructure. Instead of requiring separate electrical wires for each qubit control and readout line, the system combines all signal transmission through optical fibers, which are then converted to microwave signals at the cryogenic interface. This consolidation dramatically reduces the number of individual connections required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively scales for large numbers of qubits, minimizes thermal noise, and maintains a clean microwave environment by using optical interconnects, reducing the need for extensive electrical wiring and connectors, thus addressing the thermal, signal, and form factor issues in quantum computing packaging.
Implementation Method 1
an optical fiber cable having a plurality of optical fibers, and interfaced to the electronic subsystem
Implementation Method 2
a three dimensional (3D) optical structure having a plurality of internal waveguides, and configured to interface the optical fiber cable to the qubit package
Implementation Method 3
cascaded NIS refrigerators for localized cooling
Data Source
AI summary
The present disclosure relates to an interconnect system for interfacing an electronic subsystem to a qubit package, wherein the qubit package has a plurality of independent qubits. The system makes use of an optical fiber cable having a plurality of optical fibers, which is interfaced to the electronic subsystem. A 3D optical structure is used which has a plurality of internal waveguides, and which is configured to interface the optical fiber cable to the qubit package. The 3D optical structure further has at least one subsystem for using the plurality of waveguides to receive signals of a first type from at least one of the qubits package or the optical fiber cable, to convert the signals from the first type to a second type, and to transmit the signals in the second type to the other one of the fiber optic cable or the qubit package.