Optical Interconnect With Vertical Lens Coupling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current optical interconnects face challenges in increasing bandwidth density and energy efficiency due to high loss and limited interconnection density, especially in 3D structures and glass interposers, which restrict the length and accuracy of waveguides, making them unsuitable for high-capacity 5G network nodes and data centers.
Innovation Solution
An optical interconnect using at least two layers of optically transparent material with a first optical waveguide and a non-guided optical path, where a lens is arranged to receive and focus light, enabling vertical path segments through multiple layers without significant loss, thus increasing interconnection density and facilitating mass production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If vertical integration of photonic layers is used to increase interconnection density, then bandwidth density is improved, but optical loss increases
Solution Approach 1:
The patent transitions from planar waveguide propagation to three-dimensional free-space optical propagation through vertical holes in the substrate. This dimensional change allows light to travel vertically between waveguides on different layers without being constrained to two-dimensional paths, enabling increased interconnection density while maintaining low optical loss through direct vertical coupling.
Solution Approach 2:
The patent introduces a substrate with vertical holes as an intermediary structure that enables optical coupling between waveguides on different layers. The holes act as channels that guide and couple light between layers, facilitating low-loss vertical optical transmission while maintaining high interconnection density through the three-dimensional architecture.
2Adaptability or versatility
If evanescent coupling is used to connect photonic layers, then interconnection is achieved, but bandwidth is limited due to inability to exchange signals between non-adjacent layers
Solution Approach 1:
The patent enables direct vertical optical coupling between waveguides on non-adjacent layers through three-dimensional free-space propagation in vertical holes. This eliminates the limitation of evanescent coupling which only works between adjacent layers, allowing any waveguide on any layer to communicate with any waveguide on any other layer, thereby dramatically increasing network bandwidth and adaptability.
3Reliability
If silicon nitride waveguides with high index contrast are used, then waveguide confinement is improved, but manufacturing precision requirements increase due to sub-micrometric dimensions
Solution Approach 1:
The patent replaces the mechanical waveguide structure with sub-micrometric dimensions that requires high overlay precision with a three-dimensional free-space optical propagation system. By eliminating the need for precise sub-micrometric waveguide alignment and using larger-mode-area vertical hole structures, the system achieves comparable or superior optical confinement with relaxed manufacturing tolerances and improved yield.
4Length of stationary object
If beam propagation through holes is used for vertical coupling, then interconnection is achieved, but beam divergence limits the length of vertical segments
Solution Approach 1:
The patent optimizes the parameters of vertical hole structures, including diameter, depth, and positioning, to enable long vertical optical propagation paths with minimal loss. By carefully controlling these geometric parameters and using appropriate hole diameters that support low-divergence modes, the system achieves extended vertical segment lengths while maintaining low optical loss and high interconnection density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances interconnection density, reduces manufacturing complexity and costs, and maintains low optical loss, making it suitable for high-capacity applications like 5G network nodes and data centers.
Implementation Method 1
At least one lens is arranged at a boundary between two of the at least two layers of optically transparent material. The at least one lens is arranged to receive and focus light travelling along the first non-guided optical path.
Implementation Method 2
A first reflective element is arranged to receive light from at least one of the first non-guided optical path and the first optical waveguide and direct the light to the other of the first non-guided optical path and the first optical waveguide.
Data Source
AI summary
An optical interconnect for optically coupling at least a first optical integrated circuit and a second optical integrated circuit. The optical interconnect comprises at least two layers of optically transparent material. There is a first optical waveguide arranged along a surface of a first one of the at least two layers of optically transparent material. There is further a first non-guided optical path extending from the first optical waveguide through the at least two layers of optically transparent material. A first reflective element is arranged to receive light from at least one of the first non-guided optical path and the first optical waveguide and direct the light to the other of the first non-guided optical path and the first optical waveguide. At least one lens is arranged at a boundary between two of the at least two layers of optically transparent material. The at least one lens is arranged to receive and focus light travelling along the first non-guided optical path.