Optical Interconnect Structure for High-Speed Data Transmission
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Solution Overview
Problem
As the minimum feature size in integrated circuit dies decreases, electrical input/output (I/O) interconnects become a bottleneck for data transmission rate, necessitating an enhancement in package structures to increase data transmission rate, I/O bandwidth, and reduce transmission cost.
Innovation Solution
The implementation of an optical I/O interconnect structure, which includes a base substrate with an optical waveguide embedded in a dielectric layer, reflectors, and lenses, enables efficient lateral optical transmission paths, miniaturizing package size and reducing transmission costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electrical I/O interconnects are used to maintain compatibility with existing technology, then manufacturing ease is preserved, but data transmission rate becomes bottlenecked
Solution Approach 1:
The patent substitutes electrical interconnects with optical waveguides for data transmission. The optical waveguide structure replaces traditional electrical I/O interconnects, enabling light-based signal transmission instead of electrical signals, thereby achieving higher data transmission rates while maintaining manufacturing compatibility through standard semiconductor fabrication processes
Solution Approach 2:
The patent changes the transmission medium parameter from electrical conductors to optical waveguides. By modifying the fundamental transmission parameter from electrical to optical domain, the system achieves breakthrough in data transmission rate while the waveguide structure is integrated using existing manufacturing techniques
2Volume of moving object
If package size is reduced to meet shrinking device demands, then device miniaturization is achieved, but integration density of optical components becomes challenging
Solution Approach 1:
The patent merges the optical waveguide, reflectors, and lenses into a single integrated optical interconnect structure. This consolidation of multiple optical components into one unified structure enables miniaturization of the package while maintaining full optical transmission functionality, effectively reducing package size without sacrificing integration density
Solution Approach 2:
The patent implements a nested structure where the optical waveguide is embedded within the dielectric layer, and reflectors are positioned within the waveguide structure. This nested arrangement of optical components maximizes space utilization, enabling compact package design while maintaining high integration density
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This optical interconnect structure effectively enhances data transmission rates and reduces package size, overcoming the limitations of traditional electrical I/O interconnects by establishing efficient optical data transmission pathways.
Implementation Method 1
An optical waveguide is embedded in the base substrate. The optical waveguide includes a first end and a second end opposite to the first end.
Implementation Method 2
A first reflector is disposed between the base substrate and the first end of the optical waveguide.
Implementation Method 3
A second reflector is disposed between the base substrate and the second end of the optical waveguide.
Implementation Method 4
A first lens is disposed on the dielectric layer and located above the first end of the optical waveguide.
Implementation Method 5
A second lens is disposed on the dielectric layer and located above the second end of the optical waveguide.
Data Source
AI summary
An optical interconnect structure including a base substrate, an optical waveguide, a first reflector, a second reflector, a dielectric layer, a first lens, and a second lens is provided. The optical waveguide is embedded in the base substrate. The optical waveguide includes a first end portion and a second end portion opposite to the first end portion. The first reflector is disposed between the base substrate and the first end portion of the optical waveguide. The second reflector is disposed between the base substrate and the second end portion of the optical waveguide. The dielectric layer covers the base substrate and the optical waveguide. The first lens is disposed on the dielectric layer and located above the first end portion of the optical waveguide. The second lens is disposed on the dielectric layer and located above the second end portion of the optical waveguide.