Optical Interconnection System with Layered Backplane Architecture

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Solution Overview

Problem

Optical transmission networks face signal degradation issues such as insertion loss, return loss, and crosstalk at high bit rates, requiring a base architecture that supports high data throughput while minimizing signal degradation and reducing interconnection lengths for lower system costs and higher performance.

Innovation Solution

A base architecture with a backplane and interconnection system that limits interconnection lengths between line modules and switch modules to Manhattan lengths, providing full-mesh interconnectivity and equal switch module capacity to line module capacity, with a configuration that reduces signal loss and allows for expandability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If interconnection lengths between line modules and switch modules are reduced, then signal degradation (insertion loss, return loss, crosstalk) is minimized, but achieving full-mesh interconnectivity becomes more difficult

Engineering Contradiction:
Improvesignal integrityVSAvoidinterconnection structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies dimensionality change by transitioning from planar 2D routing to 3D routing through multiple backplane layers. Each layer provides a subset of interconnections, and the combination of layers achieves full-mesh connectivity while keeping individual interconnection lengths minimal. This resolves the contradiction by providing both short connections and complete connectivity through spatial dimensionality.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The interconnection system is segmented into multiple layers, with each layer containing specific interconnection groups. Line modules connect to switch modules through distributed connections across layers rather than single long traces. This segmentation allows each interconnection segment to be short while collectively achieving full-mesh connectivity.

Inventive Principle:
Principle #1Segmentation

2Ease of manufacture

If the number of backplane layers is reduced, then manufacturing complexity and cost decrease, but interconnection lengths increase causing signal degradation

Engineering Contradiction:
Improvebackplane manufacturingVSAvoidsignal integrity
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent utilizes the vertical dimension through multiple backplane layers to provide routing paths. Instead of using fewer layers with long horizontal traces, the system employs multiple layers with short vertical and horizontal segments, achieving both manufacturability and signal integrity through 3D routing space.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent changes the routing parameter from minimal layers with long traces to optimized multiple layers with short traces. By adjusting the number of layers and distributing interconnections across them, the system achieves optimal balance between manufacturing feasibility and signal performance.

Inventive Principle:
Principle #35Parameter changes

3Adaptability or versatility

If each line module connects to multiple switch modules, then connectivity and versatility increase, but interconnection length and complexity increase

Engineering Contradiction:
ImproveconnectivityVSAvoidinterconnection length
Core Design Contradiction:
Adaptability or versatilityVSLength of stationary object

Solution Approach 1:

The connectivity path is segmented across multiple layers, with each layer providing specific connections. A line module connects to multiple switch modules through distributed connections on different layers rather than single long connections, achieving high versatility with short individual interconnection lengths.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent uses vertical layering to provide multiple connectivity paths. Instead of extending connections horizontally across the backplane to reach multiple switch modules, the system routes connections through multiple vertical layers, keeping each interconnection segment short while achieving full connectivity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS8762920B2Interconnection system and method
Publication Date: 2014.06.24 INFINERA CORP
  • US8762920B2 patent drawing
  • US8762920B2 patent drawing
  • US8762920B2 patent drawing

AI summary

The present disclosure provides a system, apparatus and method to transport data across a network node, as part of a network infrastructure of an optical transmission system. According to the various embodiments of the disclosure, a base architecture is provided which includes interconnectivity providing high throughput, while mitigating factors which may lead to signal loss or signal degradation. The base architecture is easily expandable to accommodate additional traffic.