Optical Interconnection for Stacked ICs Using Nanostructured Antennas
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Solution Overview
Problem
The challenge in three-dimensional stacked semiconductor structures is establishing effective communication paths between vertically-stacked layers, which is complicated and costly, especially when forming via holes for metal penetration.
Innovation Solution
The implementation of an optical interconnection using an optical antenna structure that operates at an optical frequency, transmitting and receiving high-directivity beams between layers, eliminating the need for additional communication paths by utilizing nanostructures in a plasmonic waveguide and metal layers to facilitate optical signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If via holes are formed to penetrate layers for communication paths, then communication between stacked layers is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent replaces the mechanical/electrical via hole formation process with an optical communication system. Instead of forming physical conductive paths through layers using lithography and metal filling, the invention uses optical antennas that transmit and receive light signals through the stacked layers, substituting electrical signal transmission with optical signal transmission to eliminate complex via hole manufacturing
Solution Approach 2:
The patent introduces optical antennas as intermediary elements between stacked layers. These optical antennas act as mediators that convert electrical signals to optical signals for transmission through the layers and back to electrical signals, enabling communication without direct physical electrical connections between layers
2Ease of manufacture
If optical antenna structure is used for interconnection, then manufacturing is simplified, but new technology implementation is required
Solution Approach 1:
The optical antenna structure is designed to perform multiple functions: signal transmission, signal reception, and integration with existing semiconductor manufacturing processes. The nanostructure-based optical antennas can be fabricated using standard semiconductor techniques while enabling new optical communication capabilities across stacked layers
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the integration of stacked integrated circuits by enabling rapid, interference-free signal transmission between layers, reducing complexity and cost, and allowing for easier three-dimensional integration by using light instead of conductor lines.
Implementation Method 1
an optical transmission unit disposed in a first layer, the optical transmission unit comprising a first optical antenna that outputs light
Implementation Method 2
One or both of the first and second material layers may be a plasmonic waveguide which propagates an optical signal in the form of surface plasmon
Data Source
AI summary
An optical interconnection for a stacked integrated circuit, is provided. The optical interconnection includes: an optical transmission unit disposed in a first layer and an optical receiving unit disposed in a second layer, different from the first layer, and spaced apart from the optical transmission unit by a predetermined gap. The optical transmission unit includes a first optical antenna that outputs light; the optical receiving unit includes a second optical antenna which receives light transmitted from the optical transmission unit. At least one of the first and second optical antennas includes a plurality of nanostructures configured to transmit or receive an optical signal.