Multi-Chip Optical Interconnects for Low Latency Communication
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Solution Overview
Problem
As semiconductor technology advances, microprocessors face challenges with increasing latency in global on-chip wires and rising power consumption, which limits further clock frequency increases and requires high-bandwidth communication that wires struggle to meet, especially in multi-core and multi-threaded systems.
Innovation Solution
A multi-chip system using an array of chip modules that facilitate high-bandwidth communication through electromagnetically coupled proximity communication, including optical signals, allowing direct communication between semiconductor dies without intermediate processing, and utilizing optical signal paths with amplification and all-optical bypass channels for reduced latency and power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If traditional wire-based communication is used in multi-core processors, then device complexity is reduced, but communication latency increases and bandwidth requirements cannot be met
Solution Approach 1:
The patent replaces traditional electrical wire-based communication with optical communication using waveguides and light signals. This substitution enables higher communication speeds and lower latency by utilizing optical domains instead of electrical domains, directly addressing the limitation of wire-based communication in meeting terabits-per-second bandwidth requirements.
Solution Approach 2:
The patent implements three-dimensional stacking of chip modules with vertical optical interconnects, transitioning from two-dimensional planar communication to three-dimensional spatial communication. This dimensional change enables simultaneous communication paths and reduces latency by providing direct optical pathways through multiple stacking layers.
2Productivity
If clock frequency is increased to improve performance, then processing speed improves, but power consumption increases
Solution Approach 1:
The patent substitutes electrical signal transmission with optical signal transmission, which consumes less power at high frequencies. Optical communication enables high-speed data transfer without the resistive losses and capacitive loading that limit electrical wires, allowing increased processing speed without proportional increases in power consumption.
Solution Approach 2:
The patent divides the processor into multiple independent chip modules that can be selectively activated. This segmentation allows only the necessary computing resources to be powered on, reducing overall power consumption while maintaining high processing speed for active modules through efficient optical interconnects.
3Loss of time
If multiple processor cores are used to reduce latency, then communication requirements increase, but wire-based communication cannot meet bandwidth demands
Solution Approach 1:
The patent uses three-dimensional stacking with vertical optical interconnects to create multiple simultaneous communication channels. This dimensional transition enables parallel data streams between processor cores, satisfying increased bandwidth requirements of multi-core systems while maintaining low latency through direct optical pathways.
Solution Approach 2:
The patent replaces electrical wire communication with optical waveguide communication, which provides significantly higher bandwidth capacity. Optical interconnects can transmit terabits-per-second data rates, meeting the communication demands of multi-core processors without the bandwidth limitations of traditional wire-based systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient intra-chip and inter-chip communication with reduced latency and power consumption, supporting high-performance and high-bandwidth requirements, effectively addressing the limitations of traditional wire-based communication in multi-core processors.
Implementation Method 1
a first chip module (CM) and a second CM communicate data signals with each other through electromagnetically coupled proximity communication
Implementation Method 2
The first CM and the third CM are configured to optically communicate optical signals with each other via the second CM through an optical signal path
Data Source
Figure 1A
Figure 1B
Figure 2
AI summary
Embodiments of a system that includes an array of single-chip modules (CMs) are described. This array includes a first CM, a second CM coupled to the first CM, and a third CM coupled to the second CM. A given CM, which can be the first CM, the second CM or the third CM, includes a semiconductor die that is configured to communicate data signals with other CMs through electromagnetically coupled proximity communication. These proximity connectors are proximate to a surface of the semiconductor die. Moreover, the first CM and the third CM are configured to optically communicate optical signals with each other via the second CM through an optical signal path.