Optical Interposer Actuator Beam Alignment
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Solution Overview
Problem
Efficient and cost-effective alignment of optics in photonic integrated circuits (PICs) for coupling light is challenging due to methods like optical fiber arrays in V-groove arrays, which are slow and incompatible with semiconductor packaging processes, leading to yield and throughput issues.
Innovation Solution
An optical interposer with actuator beams extending from its body to align waveguides with PIC die waveguides, using thermal expansion or other forces to precisely position them through controlled current flow in traces on the actuator beams.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If optical fiber arrays are attached to V-groove arrays in PICs, then alignment of optics for coupling light can be achieved, but the process becomes slow and incompatible with conventional semiconductor packaging processes, resulting in substantial yield and throughput issues
Solution Approach 1:
The patent replaces the mechanical attachment process of optical fiber arrays to V-groove arrays with a photonic approach using waveguides that are optically coupled through the semiconductor substrate. This substitution eliminates the need for mechanical alignment operations during packaging, enabling compatibility with conventional semiconductor manufacturing processes and significantly improving throughput while maintaining alignment precision through the integrated waveguide structure
Solution Approach 2:
The patent merges the optical coupling function directly into the semiconductor packaging substrate by integrating waveguides that extend through the substrate thickness. This merging of optical functionality with the structural substrate eliminates separate alignment operations and allows conventional semiconductor packaging processes to be used, thereby resolving the contradiction between precision and productivity
2Manufacturing precision
If optical fiber arrays are attached to V-groove arrays in PICs, then alignment of optics for coupling light can be achieved, but the process becomes slow and incompatible with conventional semiconductor packaging processes, resulting in substantial yield issues
Solution Approach 1:
The patent replaces mechanical attachment operations with an integrated photonic waveguide structure that is formed as part of the semiconductor device. This eliminates operations that are incompatible with conventional semiconductor packaging, thereby improving yield by removing sources of process failure while maintaining the alignment precision required for effective optical coupling
Solution Approach 2:
The waveguide structure is pre-formed and integrated into the semiconductor device during fabrication, with alignment features and coupling interfaces prepared in advance. This preliminary integration ensures that subsequent packaging processes do not require complex alignment operations, thereby improving yield by eliminating steps that could introduce defects or failures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides high-yield, high-throughput optical packing solutions for PICs, ensuring accurate and cost-effective alignment with PICs, suitable for applications like data center networking and AI training.
Implementation Method 1
using thermal expansion or other forces to precisely position them through controlled current flow in traces on the actuator beams
Data Source
AI summary
Technologies for an optical interposer with actuator beams are disclosed. In one embodiment, an integrated circuit package includes an optical interposer and a photonics integrated circuit (PIC) die. The optical interposer includes actuator beams and waveguides embedded in the actuator beams. An electrical trace is disposed on the actuator beams. In use, current can pass through the electrical trace, expanding the trace through thermal expansion. The trace expands more than the actuator beam underneath it, causing the actuator beam and the waveguides to be deflected. In this manner, the waveguides in the optical interposer can be positioned to align to waveguides in the PIC die.